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Soft cover. Zustand: Fine. First Edition. vii, 216p. A fine copy. Size: 8vo - over 7¾" - 9¾" tall. Book.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the 'memory wall' problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.

Hardcover. Zustand: Brand New. 371 pages. 10.98x8.26x0.94 inches. In Stock.

Zustand: New. In.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This conference is one of the most significant annual events of the China Electrotechnical Society, showcasing the latest research trends, methodologies, and experimental results in electrical, electronic, and networked energy systems. The proceedings cover a wide range of cutting-edge theories and ideas, including topics such as power systems, power electronics, smart grids, renewable energy, energy integration in transportation, advanced power technologies, and the energy internet.The aim of these proceedings is to provide a key interdisciplinary platform for researchers, engineers, academics, and industry professionals to present groundbreaking developments in the field of electrical, electronic, and networked energy systems. It also offers engineers and researchers from academia, industry, and government a comprehensive view of innovative solutions that integrate concepts from multiple disciplines.These volumes serve as a valuable reference for researchers and graduate students in electrical engineering.