Hou wei (40 Ergebnisse)

Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Softcover. Zustand: Très bon. Ancien livre de bibliothèque avec équipements. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Ammareal gives back up to 15% of this item's net price to charity organizations.…

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352 pp.; 27.8 x 22.8 cm.; screw bound; black-and-white & color; edition size unknown; unsigned and unnumbered; offset-printed; Exhibition catalogue published in conjunction with show held at the Walker Art Center, Minneapolis, Minnesota, February ? May, 2003. Traveled to Fondazione Sandretto Re Rebaudengo per l'arte, Turin, Italy, June - September, 2003 and Contemporary Arts Museum Houston, Texas, July - September, 2004. Curated by Philippe Vergne with Olukemi Ilesanmi and Douglas Fogle. Texts by Philippe Vergne, Olukemi Ilesanmi, Douglas Fogle, Vasif Kortun, Cuauhtémoc Medina, Hou Hanru, Steve Dietz, Gunalan Nadarajan, Yukiko Shikata, Raqs Media Collective, Kathy Halbreich, Vishakha Desai, Sarah Schultz, Kiyoko Motoyama Sims, Susan Rotilie, Christi Atkinson, Meredith Walters, Philip Bither, Baraka Sele, Otori Hidenaga, Cis Bierinckx, Paulo Herkenhoff, and Aimee Chang. Additional selected reading material by Hélio Oiticica, Arjun Apppadurai, and others. Artists include Allora & Calzadilla, Hüseyin Bahri Alptekin, Can Altay, Kaoru Arima, Atelier Bow Wow, Cabelo, Franklin Cassaro, Santiago Cucullu, Anita Dube, Esra Ersen, Sheela Gowda, Zon Ito, Cameron Jamie, Gülsun Karamustafa, Moshekwa Langa, Marepe, Hiroyuki Oki, Tsuyoshi Ozawa, Robin Rhode, Usha Seejarim, Ranjani Shettar, Song Dong, Tabaimo, Wang Jian Wei, Yin Xiuzhen, Zhao Liang, and Raqs Media Collective. Fine. Covers and contents clean and unmarked. Due to size and weight additional shipping may be required for international orders.…

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Zustand: New. In.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Paperback. Zustand: Brand New. 335 pages. 9.25x6.10x0.75 inches. In Stock.

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Couverture souple. Zustand: bon. RO40056820: 1987. In-12. Broché. Bon état, Couv. convenable, Dos satisfaisant, Intérieur frais. 336 pages. Texte sur deux colonnes en français et japonais. Quelques rousseurs. Couverture contrepliée. . . . Classification Dewey : 413-Dictionnaire bilingue.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book constitutes the proceedings of the 22nd International Conference on Formal Engineering Methods, ICFEM 2020, held in Singapore, Singapore, in March 2021. The 16 full and 4 short papers presented together with 1 doctoral symposium paper in this volume were carefully reviewed and selected from 41 submissions. The papers cover theory and applications in formal engineering methods together with case studies. They also represent the recent development in the use and development of formal engineering methods for software and system development.…

Couverture souple. Zustand: bon. RO30340281: 1987. In-12. Broché. Etat passable, Coins frottés, Dos fané, Papier jauni. 336 pages. Texte sur deux colonnes en français et japonais. Quelques rousseurs. Couverture contrepliée. . . . Classification Dewey : 413-Dictionnaire bilingue.

Taschenbuch. Zustand: Neu. Formal Methods and Software Engineering | 22nd International Conference on Formal Engineering Methods, ICFEM 2020, Singapore, Singapore, March 1-3, 2021, Proceedings | Shang-Wei Lin (u. a.) | Taschenbuch | Lecture Notes in Computer Science | xi | Englisch | 2020 | Springer | EAN 9783030634056 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Zustand: New.

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. pp. xiv + 536 Illus.

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Zustand: New.

Paperback. Zustand: Brand New. 2011 edition. 208 pages. 9.25x6.10x0.38 inches. In Stock.

Hardcover. Zustand: Brand New. 157 pages. 9.20x6.30x0.70 inches. In Stock.

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Zustand: New. In English.

Hardcover. Zustand: Brand New. 448 pages. 6.30x0.83x9.33 inches. In Stock.

Hardcover. Zustand: Brand New. 448 pages. 6.30x0.83x9.33 inches. In Stock.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics.To help readers cope with the increasing sophistication of FEMs¿ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will:introduce the principle of FEMs;review numerical modeling of ULSI interconnect reliability;describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; anddiscuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method.A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader¿s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included.Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability. …

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Zustand: New. In.

Hardcover. Zustand: Brand New. har/psc edition. 447 pages. 9.25x6.25x1.00 inches. In Stock.