Hassoun soha (8 Ergebnisse)

Zustand: New. In English.

Paperback. Zustand: Brand New. 2013 edition. 86 pages. 9.00x6.00x0.25 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a oorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.…

paperback. Zustand: Very Good.

Zustand: New. In English.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Logic Synthesis and Verification | Soha Hassoun (u. a.) | Taschenbuch | The Springer International Series in Engineering and Computer Science | xv | Englisch | 2013 | Springer | EAN 9781461352532 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Zustand: New. Research and development of logic synthesis and verification have matured considerably. Many commercial products are available, and they have been critical in harnessing advances in fabrication technology to produce today's plethora of electronic components. This book presents an overview of logic synthesis and verification. Editor(s): Hassoun, Soha; Sasao, Tsutomu. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 454 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 25. Weight in Grams: 835. . 2001. Hardback. . . . . Books ship from the US and Ireland.…