Sprache: Englisch
Verlag: Springer Nature Singapore, 2022
ISBN 10: 9811931313 ISBN 13: 9789811931314
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 231,58
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 188 pages. 9.25x6.10x0.63 inches. In Stock.