Anbieter: Hamelyn, Madrid, M, Spanien
Zustand: Bueno. : Este libro trata sobre los procesos de CMP (Chemical Mechanical Planarization) y pulido, que son los métodos más precisos utilizados para el acabado de superficies de componentes mecánicos, electrónicos o semiconductores. Incluye referencias bibliográficas e índice. EAN: 9781437778595 Tipo: Libros Categoría: Tecnología Título: Advances in CMP/polishing technologies for the manufacture of electronic devices Autor: Ioan D. Marinescu| Toshiro K. Doi| Syuhei Kurokawa Editorial: Elsevier, William Andrew Idioma: eng Páginas: 317 Formato: tapa dura.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 143,64
Anzahl: 3 verfügbar
In den WarenkorbZustand: New. pp. 544.
Anbieter: Phatpocket Limited, Waltham Abbey, HERTS, Vereinigtes Königreich
EUR 142,87
Anzahl: 1 verfügbar
In den WarenkorbZustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 145,19
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 2nd edition. 486 pages. 9.25x6.25x1.25 inches. In Stock.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 189,23
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
EUR 196,55
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engin.
Anbieter: moluna, Greven, Deutschland
EUR 273,05
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Marinescu, Ioan D. Uhlmann, Eckart Doi, ToshiroLapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the.
Sprache: Englisch
Verlag: Taylor & Francis Inc Nov 2006, 2006
ISBN 10: 1574446703 ISBN 13: 9781574446708
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Neuware - Describes the most precise processes available for finishing the surfaces of mechanical as well as electronics and semiconductor components. This book presents an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. It builds on this foundation to discuss lapping of ductile and brittle materials.