Dimitrios soudris (87 Ergebnisse)

hardcover. Zustand: Like New. Most items will be dispatched the same or the next working day. An apparently unread copy in perfect condition. Dust cover is intact with no nicks or tears. Spine has no signs of creasing. Pages are clean and not marred by notes or folds of any kind.

Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.…

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This open access book provides an overview of the results of a large university collaboration addressing the emerging topic of distributed, localized energy grids and also smart grids. The authors discuss promising, consolidated results from their consortium research activities from the past decade. The methods described achieve unprecedented accuracy levels within reasonable run-times, compatible with on-line monitoring and forecasting as needed for smart grids.Discusses physics-based, short-term wind turbine and PV Eyield forecasting techniques, which enable unprecedented accuracy;Describes a multi-time-scale energy management framework, combining renewable production, HVAC loads and battery storage;Enables up-scalable approach to aggregated HVAC load modelling and forecasting. …

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This open access book provides an overview of the results of a large university collaboration addressing the emerging topic of distributed, localized energy grids and also smart grids. The authors discuss promising, consolidated results from their consortium research activities from the past decade. The methods described achieve unprecedented accuracy levels within reasonable run-times, compatible with on-line monitoring and forecasting as needed for smart grids.Discusses physics-based, short-term wind turbine and PV Eyield forecasting techniques, which enable unprecedented accuracy;Describes a multi-time-scale energy management framework, combining renewable production, HVAC loads and battery storage;Enables up-scalable approach to aggregated HVAC load modelling and forecasting. …

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 13-15, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state of the art and the new developments in the field of VLSI systems and their designs. The purpose of the conference was to provide a forum to exchange ideas and to present industrial and research results in the fields of VLSI/ULSI systems, embedded systems and - croelectronic design and test.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thisworkshopisthetenthinaseriesofinternationalworkshops. Thisyear ittakesplaceinG ottingen,Germany,andisorganizedbytheUniversityof Hannover. G ottingenhasonethemostfamousGermanuniversities,whereverywell knownscientistslikeLichtenberg,Hilbert,GaussandvonNeumannstudied, workedandtaught. ItalsohostsseveralresearchinstitutesoftheMax-Planck- Society. The rstelectronictubecalculatorG1wasbuiltinG ottingenin1952 byH. Billing. Additionally,G ottingenwasselectedbecauseitisadjacenttothe worldexpositionEXPO2000inHannoverwhichgivesanoutlookintothe21st centurycoveringthemajortopicsofhumankind,natureandtechnology. WithrespecttotheseinspiringsurroundingsthetechnicalprogramofPAT- MOS2000includes10sessionsdedicatedtomostimportantsubjectsofpower andtimingmodeling,optimizationandsimulationatthedawnofthe21stc- tury. ThefourinvitedtalksaddresstheEuropeanresearchactivitiesinthewo- shop elds,theevolvingneedsforminimalpowerconsumptionintheareaof wirelessandchipcardapplicationsanddesignmethodologiesofveryhighly- tegratedmultimediaprocessors. Theworkshopisaresultofthejointworkofalargenumberofindividuals, whocannotallbementionedhere. Inparticular,wewouldliketoacknowledge theoutstandingworkofthereviewers,whodidacompetentjobinatimely manner. Wealsohavetothankthemembersofthelocalorganizingcommittee fortheire ortinenablingtheconferencetorunsmoothly. Finally,wegratefully acknowledgethesupportofallorganizationsandinstitutionssponsoringthe conference. September2000 PeterPirsch ErichBarke DimitriosSoudris Organization OrganizationCommitee GeneralCoChairs: PeterPirsch(UniversityofHannover,Germany) ErichBarke(UniversityofHannover,Germany) ProgramChair: DimitriosSoudris (DemocritusUniversityofThrace,Greece) FinanceChair: LarsHedrich(UniversityofHannover,Germany) PublicationChair: AchimFreimann (UniversityofHannover,Germany) Audio-VisualChair: J orgAbke(UniversityofHannover,Germany) LocalArrangementsChair: CarstenReuter(UniversityofHannover,Germany) ProgramCommitee D. Auvergne(UniversityofMontpellier,France) J. Bormans(IMEC,Belgium) J. Figueras(UniversityofCatalunya,Spain) C. E. Goutis(UniversityofPatras,Greece) A. Guyot(INPGGrenoble,France) R. Hartenstein(UniversityofKaiserslautern,Germany) S. Jones(UniversityofLoughborough,UnitedKingdom) P. Larsson-Edefors(UniversityofLink oping,Sweden) E. Macii(PolytechnicofTorino,Italy) V. Moshnyaga(UniversityofFukuoka,Japan) W. Nebel(UniversityofOldenburg,Germany) J. A. Nossek(TechnicalUniversityofMunc hen,Germany) A. Nunez(UniversityofLasPalmas,Spain) M. Papaefthymiou(UniversityofMichigan,UnitedStates) M. Pedram(UniversityofSouthernCalifornia,UnitedStates) H. P eiderer(UniversityofUlm,Germany) C. Piguet(CSEM,Switzerland) R. Reis(UniversityofPortoAlegre,Brazil) M. Robert(UniversityofMontpellier,France) A. Rubio(UniversityofCatalunya,Spain) J. Sparsø(TechnicalUniversityofDenmark,Denmark) A. Stempkowsky(AcademyofSciences,Russia) T. Stouraitis(UniversityofPatras,Greece) J. F. M. Theeuwen(Philips,TheNetherlands) A. -M. Trullemans-Anckaert(UniversityofLouvain,Belgium) R. Zafalon(STMicroelectronics,Italy) VIII Organization SteeringCommitee D. Auvergne(UniversityofMontpellier,France) R. Hartenstein(UniversityofKaiserslautern,Germany) W. Nebel(UniversityofOldenburg,Germany) C. Piguet(CSEM,Switzerland) A. Rubio(UniversityofCatalunya,Spain) J. Sparsø(TechnicalUniversityofDenmark,Denmark) A. -M. Trullemans-Anckaert(UniversityofLouvain,Belgium) SponsoringInstitutions EuropeanCommissionDirectorate GeneralInformationSociety IEEECircuitsandSystemsSociety TableofContents Opening Constraints, Hurdles, and Opportunities for a Successful European Take-Up Action . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 R. vanLeuken,R. Nouta,A. deGraf(DelftUniversityofTechnology, TheNetherlands) RTL Power Modeling Architectural Design Space Exploration Achieved through Innovative RTL Power Estimation Techniques. . . . . . . . . . . . . . . . . . 3 M. Anton,M. Chinosi,D. Sirtori,R. Zafalon(STMicroelectronics, Italy) Power Models for Semi-autonom.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book constitutes the refereed proceedings of the 11th International Symposium on Applied Reconfigurable Computing, ARC 2015, held in Bochum, Germany, in April 2015. The 23 full papers and 20 short papers presented in this volume were carefully reviewed and selected from 85 submissions. They are organized in topical headings named: architecture and modeling; tools and compilers; systems and applications; network-on-a-chip; cryptography applications; extended abstracts of posters. In addition, the book contains invited papers on funded R&D - running and completed projects and Horizon 2020 funded projects.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 13-15, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state of the art and the new developments in the field of VLSI systems and their designs. The purpose of the conference was to provide a forum to exchange ideas and to present industrial and research results in the fields of VLSI/ULSI systems, embedded systems and - croelectronic design and test.…

Hardcover. Zustand: Brand New. 2015 edition. 243 pages. 9.25x6.25x0.75 inches. In Stock.

Hardcover. Zustand: Brand New. 295 pages. 9.25x6.25x1.00 inches. In Stock.

Zustand: New. pp. 240 109 Illus.

Paperback. Zustand: Brand New. 2010 edition. 304 pages. 9.25x6.10x0.69 inches. In Stock.

Zustand: New. Kostas Siozios, Dimitrios Soudris, Elias KosmatopoulosAs systems continue to evolve they rely less on human decision-making and more on computational intelligence. This trend in conjunction to the available technologies for providing advanced sen.

Paperback. Zustand: Brand New. 2015 edition. 550 pages. 9.00x6.00x1.25 inches. In Stock.

Paperback. Zustand: Brand New. 254 pages. 9.25x6.10x0.58 inches. In Stock.

Zustand: New.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Energy Production, Load and Battery Management Framework with Supporting Methods for Smart Microgrids | Francky Catthoor (u. a.) | Taschenbuch | x | Englisch | 2026 | Springer | EAN 9783031920271 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Zustand: Neu. VLSI-SoC: Design Methodologies for SoC and SiP | 16th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2008, Rhodes Island, Greece, October 13-15, 2008, Revised Selected Papers | Christian Piguet (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | xii | Englisch | 2014 | Springer | EAN 9783642422416 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Zustand: Neu. Applied Reconfigurable Computing | 11th International Symposium, ARC 2015, Bochum, Germany, April 13-17, 2015, Proceedings | Kentaro Sano (u. a.) | Taschenbuch | Lecture Notes in Computer Science | xviii | Englisch | 2015 | Springer | EAN 9783319162133 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Zustand: Neu. Three Dimensional System Integration | IC Stacking Process and Design | Antonis Papanikolaou (u. a.) | Taschenbuch | viii | Englisch | 2014 | Springer | EAN 9781489981820 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …