cong jason (33 Ergebnisse)

paperback. Zustand: Very Good. May have light to moderate shelf wear and/or a remainder mark. Complete. Clean pages.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. pp. 120.

Zustand: New. volumes cm.

Paperback. Zustand: Brand New. 120 pages. 9.25x6.25x0.25 inches. In Stock.

gebundene Ausgabe. Zustand: Gut. 321 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 700.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Very Good. Unused, some outer edges have minor scuffs, cover has light scratches, some outer pages have marks from shelf wear, book content is in like new condition.

Kluwer, Boston, 1992. XIII, 130 pages, hard cover----former library book in good condition- 434 Gramm.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.

Zustand: New.

Taschenbuch. Zustand: Neu. Multilevel Optimization in VLSICAD | Joseph R. Shinnerl (u. a.) | Taschenbuch | xix | Englisch | 2011 | Springer US | EAN 9781441952400 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Three-Dimensional Integrated Circuit Design | EDA, Design and Microarchitectures | Yuan Xie (u. a.) | Taschenbuch | xii | Englisch | 2012 | Springer US | EAN 9781461425137 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive, up-to-date picture of national education in Hong Kong. At the societal level, it offers an in-depth understanding of a divisive issue for Hongkongers, elaborating the official approach so that diverse stakeholders have a basis for re-evaluating the nature and implementation of national education for rational and critical dialogue. At the policy and curricular level, it offers evidence-based suggestions to foster inclusive and reflective decision-making and curriculum development related to national education. At a practical level it facilitates the teaching of national education in schools and helps diverse stakeholders to reflect on how national education relates to them, and what they can do to co-construct an inclusive and reflective national education. The book will interest researchers in multicultural education, national identity, identity politics and China and Hong Kong Studies.

Taschenbuch. Zustand: Neu. Modern Circuit Placement | Best Practices and Results | Jingsheng Jason Cong (u. a.) | Taschenbuch | xx | Englisch | 2010 | Springer | EAN 9781441942319 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Buch. Zustand: Neu. Neuware -Modern Circuit Placement: Best Practices and Results describes advanced techniques in VLSI circuit placement which is one of the most important steps of the VLSI physical design flow. Physical design addresses the back-end layout stage of the chip design process. As technology scales down, the significance of interconnect optimization becomes much more important and physical design, particularly the placement process, is essential to interconnect optimization.This book has four unique characteristics. First, it focuses on the most recent highly scalable placement techniques used for multi-million gate circuit designs, with consideration of many practical aspects of modern circuit placement, such as density and routability control, mixed-size placement support, and area I/O support. Second the book addresses dominant techniques being used in the field. This book includes all the academic placement tools that competed at the International Symposium on Physical Design (ISPD) placement contest in 2005 and 2006. Although these tools are developed by academia, many core techniques in these tools are being used extensively in industry and represent today¿s advanced placement techniques. Third, the book provides quantitative comparison among the various techniques on common benchmark circuits derived from real-life industrial designs. The book includes significant amounts of analysis on each technique, such as trade-offs between quality-of-results (QoR) and runtime. Finally, analysis of the optimality of the placement techniques is included. This is done by utilizing placement benchmarks with known optimal solutions, yet with characteristics similar to real industrial designs.Modern Circuit Placement: Best Practices and Results is a valuable tool and a must-read for graduate students, researchers and CAD tool developers in the VLSI physical synthesis and physical design fields.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 344 pp. Englisch.

Hardcover. Zustand: Brand New. 151 pages. 8.27x5.83x8.27 inches. In Stock.

Gebunden. Zustand: New. In the last few decades, multiscale algorithms have become a dominant trend in large-scale scientific computation. Researchers have successfully applied these methods to a wide range of simulation and optimization problems. This book gives a general over.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - In the last few decades, multiscale algorithms have become a dominant trend in large-scale scientific computation. Researchers have successfully applied these methods to a wide range of simulation and optimization problems. This book gives a general overview of multiscale algorithms; applications to general combinatorial optimization problems such as graph partitioning and the traveling salesman problem; and VLSICAD applications, including circuit partitioning, placement, and VLSI routing. Additional chapters discuss optimization in reconfigurable computing, convergence in multilevel optimization, and model problems with PDE constraints. Audience: Written at the graduate level, the book is intended for engineers and mathematical and computational scientists studying large-scale optimization in electronic design automation.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Modern Circuit Placement: Best Practices and Results describes advanced techniques in VLSI circuit placement which is one of the most important steps of the VLSI physical design flow. Physical design addresses the back-end layout stage of the chip design process. As technology scales down, the significance of interconnect optimization becomes much more important and physical design, particularly the placement process, is essential to interconnect optimization.This book has four unique characteristics. First, it focuses on the most recent highly scalable placement techniques used for multi-million gate circuit designs, with consideration of many practical aspects of modern circuit placement, such as density and routability control, mixed-size placement support, and area I/O support. Second the book addresses dominant techniques being used in the field. This book includes all the academic placement tools that competed at the International Symposium on Physical Design (ISPD) placement contest in 2005 and 2006. Although these tools are developed by academia, many core techniques in these tools are being used extensively in industry and represent today's advanced placement techniques. Third, the book provides quantitative comparison among the various techniques on common benchmark circuits derived from real-life industrial designs. The book includes significant amounts of analysis on each technique, such as trade-offs between quality-of-results (QoR) and runtime. Finally, analysis of the optimality of the placement techniques is included. This is done by utilizing placement benchmarks with known optimal solutions, yet with characteristics similar to real industrial designs. Modern Circuit Placement: Best Practices and Results is a valuable tool and a must-read for graduate students, researchers and CAD tool developers in the VLSI physical synthesis and physical design fields.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Modern Circuit Placement: Best Practices and Results describes advanced techniques in VLSI circuit placement which is one of the most important steps of the VLSI physical design flow. Physical design addresses the back-end layout stage of the chip design process. As technology scales down, the significance of interconnect optimization becomes much more important and physical design, particularly the placement process, is essential to interconnect optimization.This book has four unique characteristics. First, it focuses on the most recent highly scalable placement techniques used for multi-million gate circuit designs, with consideration of many practical aspects of modern circuit placement, such as density and routability control, mixed-size placement support, and area I/O support. Second the book addresses dominant techniques being used in the field. This book includes all the academic placement tools that competed at the International Symposium on Physical Design (ISPD) placement contest in 2005 and 2006. Although these tools are developed by academia, many core techniques in these tools are being used extensively in industry and represent today's advanced placement techniques. Third, the book provides quantitative comparison among the various techniques on common benchmark circuits derived from real-life industrial designs. The book includes significant amounts of analysis on each technique, such as trade-offs between quality-of-results (QoR) and runtime. Finally, analysis of the optimality of the placement techniques is included. This is done by utilizing placement benchmarks with known optimal solutions, yet with characteristics similar to real industrial designs. Modern Circuit Placement: Best Practices and Results is a valuable tool and a must-read for graduate students, researchers and CAD tool developers in the VLSI physical synthesis and physical design fields.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.

Zustand: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher.

Zustand: New.

Paperback. Zustand: Brand New. 296 pages. 9.25x6.10x0.67 inches. In Stock.

Paperback. Zustand: Brand New. 320 pages. 9.21x6.14x0.87 inches. In Stock.

Paperback. Zustand: Brand New. 324 pages. 9.00x6.00x0.78 inches. In Stock.

Hardcover. Zustand: Brand New. 184 pages. 9.19x6.13x0.61 inches. In Stock.