Sprache: Englisch
Verlag: Brookhaven University of Science, 1965
Anbieter: Versandantiquariat Karin Dykes, Nürnberg, Deutschland
weicher Einband. Softcover, 27,5 x 21,5cm, 8 pages, cover with a fleck, otherwise light traces of usage, good condition for the age. 50 50 gr.
Anbieter: Librería Pérez Galdós, Madrid, M, Spanien
Zustand: leido. rústsolap. BUEN ESTADO 480.
Pappband, 0. 4°, XII, 412 S., zahlr. graph. Darst., Pappband, Buch gut erhalten, leichte Gebrauchsspuren, Einband bzw. Schutzumschlag sowie Ecken u. Kanten leicht berieben RW 16 R 1/A Sprache: Englischglisch, 0,920 gr.
Zustand: Very good.
Anbieter: Phatpocket Limited, Waltham Abbey, HERTS, Vereinigtes Königreich
EUR 113,01
Anzahl: 1 verfügbar
In den WarenkorbZustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
Anbieter: Books From California, Simi Valley, CA, USA
hardcover. Zustand: Fine.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 117,82
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Hervorragend. Zustand: Hervorragend | Seiten: 452 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
EUR 144,28
Anzahl: 3 verfügbar
In den WarenkorbZustand: New. pp. 300.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 151,95
Anzahl: 3 verfügbar
In den WarenkorbZustand: New.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 162,91
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 162,91
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Zustand: Very Good. Very Good; Hardcover; Covers are still glossy; Unblemished textblock edges; The endpapers and all text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium-Large Format (Quatro, 9.75" - 10.75" tall); Purple and yellow covers with title in whtie and blue lettering; 2002, Newnes Publishing; 288 pages; "Reflow Soldering Processes," by Ning-Cheng Lee PhD.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 168,98
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 182,07
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. 548 pages. 9.25x6.10x0.94 inches. In Stock.
Sprache: Englisch
Verlag: Springer Nature Singapore, Springer Nature Singapore, 2021
ISBN 10: 9811539227 ISBN 13: 9789811539220
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 218,35
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 360 pages. 9.18x6.12x9.21 inches. In Stock.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 229,91
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 204 pages. 9.50x6.25x0.75 inches. In Stock.
Sprache: Englisch
Verlag: Springer Nature Singapore, Springer Nature Singapore, 2020
ISBN 10: 9811539197 ISBN 13: 9789811539190
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Couverture souple. Zustand: bon. RO20268228: NON DATE. In-8. Broché. Etat d'usage, Couv. convenable, Coiffe en pied abîmée, Quelques rousseurs. environ 200 pages - en chinois et anglais - Abondante planches illustrées en couleur (reproductions d'aquarelles) - légères tâches sur la couverture - Inclus une carte postale vierge, representant une aquarelle de Michele Gondinet, en couleur. . . . Classification Dewey : 495-Langues d'Asie.
Sprache: Chinesisch
Verlag: China Building Industry Press Pub. Date :2009-08-0, 1991
ISBN 10: 7112111285 ISBN 13: 9787112111282
Anbieter: Mooney's bookstore, Den Helder, Niederlande
Zustand: Very good.