Thermal Testing of Integrated Circuits

Beschreibung

Neuware -Integrated circuits (IC's) have undergone a significant evolution in terms of complexity and performance as a result 'of the substantial advances made in manufacturing technology. Circuits, in their various mixed formats, can be made up tens or even hundreds of millions of devices. They work at extremely low voltages and switch at very high frequencies. Testing of circuits has become an essential process in IC manufacturing, in the effort to ensure that the manufactured components have the appropriate levels of quality. Along with the ongoing trend towards more advanced technology and circuit features, major testing challenges are continuously emerging. The use of ambivalent procedures to test the analogue and digital sections of such complex circuits without interfering in their nominal operation is clearly a critical part of today's technological ipdustries. Chapter 1 presents the general purposes and basic concepts rel~ted With' the'testing of integrated circuits, discussing the various strategies and their limitations. Readers who are already familiar with the field may opt to skip this chapter. This book offers a multidisciplinary focus on thermal testing. This is a testing method which is not only suitable for use in combination with other existing techniques, but is also backed by a wealth of knowledge and offers exciting opportunities in the form of as yet unexplored areas of research and innovation for industrial applications.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 220 pp. Englisch.

Bestandsnummer des Verkäufers 9781402070761

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Bibliografische Details

Titel

Thermal Testing of Integrated Circuits

Verlag

Springer US, Springer US Jun 2002

Erscheinungsjahr

2002

Sprache

Englisch

ISBN-10

1402070764

ISBN-13

9781402070761

Einband

Buch

Zustand

Neu

Abmessungen

241B x 160 H x 18 T Millimeter Breite: 241 mm, Höhe: 160 mm, Tiefe: 18 mm

Gewicht

500 Gramm

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