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410 Ex-library book in GOOD condition, some traces of use, with stamp and signature. Ehem. Bibliotheksexemplar mit Stempel und Signatur, ein paar Gebrauchsspuren. 9780471780465 Sprache: Englisch Gewicht in Gramm: 550. Bestandsnummer des Verkäufers 717030
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
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Preliminary Concepts
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Parasitic Resistances, Capacitances, and Inductances
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Interconnection Delays
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Crosstalk Analysis
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Electromigration-Induced Failure Analysis
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Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Über die Autorin bzw. den Autor:
AShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit design, high-speed VLSI interconnections, device physics and modeling, and semiconductor TCAD.
Titel: High-speed VLSI interconnections. .
Verlag: Hoboken, New Jersey, IEEE Press Wiley-Interscience a John Wiley & Sons Inc. publication
Erscheinungsdatum: 2007
Einband: Hardcover
Auflage: Second edition.
Anbieter: Bestsellersuk, Hereford, Vereinigtes Königreich
hardcover. Zustand: Good. warped, bumps and scratches to cover, dirty marks to edges of pages No.1 BESTSELLERS - great prices, friendly customer service â" all orders are dispatched next working day. Artikel-Nr. mon0000834491
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Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABNR-6880
Anzahl: 1 verfügbar
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABNR-204423
Anzahl: 2 verfügbar
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
Zustand: New. pp. xix + 407 Illus. Artikel-Nr. 7484817
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Anbieter: moluna, Greven, Deutschland
Gebunden. Zustand: New. AShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit d. Artikel-Nr. 556562547
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Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New. 2007. 2nd Revised edition. Hardcover. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Series: Wiley Series in Microwave and Optical Engineering. Num Pages: 432 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 236 x 163 x 25. Weight in Grams: 730. . . . . . Books ship from the US and Ireland. Artikel-Nr. V9780471780465
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