Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 182,77
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
EUR 200,47
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In den WarenkorbZustand: New. AShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit d.
EUR 263,84
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 2nd edition. 407 pages. 9.50x6.50x1.25 inches. In Stock.
Zustand: New. 2007. 2nd Revised edition. Hardcover. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Series: Wiley Series in Microwave and Optical Engineering. Num Pages: 432 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 236 x 163 x 25. Weight in Grams: 730. . . . . . Books ship from the US and Ireland.
EUR 298,89
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In den WarenkorbZustand: New. pp. xix + 407 Illus.
Sprache: Englisch
Verlag: John Wiley & Sons Sep 2007, 2007
ISBN 10: 0471780464 ISBN 13: 9780471780465
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Neuware - This Second Edition focuses on emerging topics and advances in the field of VLSI interconnectionsIn the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:\*Preliminary Concepts\*Parasitic Resistances, Capacitances, and Inductances\*Interconnection Delays\*Crosstalk Analysis\*Electromigration-Induced Failure Analysis\*Future InterconnectionsHigh-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.