Handbook of Fine Pitch Surface Mount Technology (FPT) is a "one-stop" guide to the state of the art of FPT. For professionals active in FPT research and development, those who wish to master FPT problem-solving methods, and those who must choose a high-yield and cost-effective manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field.
The topics covered include fine pitch surface mount packages and their solderability characteristics, printed circuit board materials and designs, solder paste and printing technology, pick and place, solder volume estimation, vapor phase, convection/IR, forced convection with nitrogen, pulsed thermode hotbar solder reflow methods, non-CFC (aqueous, semiaqueous, and no-clean) cleaning, inspection, repair, total quality management, statistical process control, thermal management, electrical testing, reliability, and technical management.
This book offers contributions from a wide array of experts who address areas covering the most advanced research and solutions technology in the field today. With this volume, you will develop a practical understanding of the economic, design, material, process, equipment, quality, testing, reliability, and management issues of FPT.

Rese�a del editor

Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.

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