Verwandte Artikel zu Force Sensors for Microelectronic Packaging Applications...
Inhaltsangabe
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Von der hinteren Coverseite
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
Neu kaufen
Diesen Artikel anzeigen
EUR 27,20
EUR 7,52 für den Versand von Vereinigtes Königreich nach USA
Versandziele, Kosten & DauerWeitere beliebte Ausgaben desselben Titels
Suchergebnisse für Force Sensors for Microelectronic Packaging Applications...
Beispielbild für diese ISBN
Force Sensors for Microelectronic Packaging Applications
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. pp. 188 Illus. Artikel-Nr. 7518121
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
Forse Sensors for Microelectronic Packaging Applications.
Anbieter: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Deutschland
Verkäuferbewertung 5 von 5 Sternen
149 figs., VIII, 178 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Microtechnology and Mems. Sprache: Englisch. Artikel-Nr. 2471AB
Anzahl: 2 verfügbar
Beispielbild für diese ISBN
Force Sensors For Microelectronic Packaging Applications
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABNR-85722
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. In. Artikel-Nr. ria9783540221876_new
Anzahl: Mehr als 20 verfügbar
Foto des Verkäufers
Force Sensors for Microelectronic Packaging Applications
Anbieter: moluna, Greven, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Gebunden. Zustand: New. Useful technique for packaging process control and analysisIntended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces no. Artikel-Nr. 4885416
Anzahl: Mehr als 20 verfügbar
Foto des Verkäufers
Force Sensors for Microelectronic Packaging Applications
Verlag:
Springer, Berlin, Springer Berlin Heidelberg, Springer, 2004
ISBN 10: 3540221875
ISBN 13: 9783540221876
Neu
Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Buch. Zustand: Neu. Neuware - Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging. Artikel-Nr. 9783540221876
Anzahl: 2 verfügbar