It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance.
Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile.
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Katerina Raleva, the Faculty of Electrical Engineering and Information Technologies Katerina Raleva is currently an Associate Professor of Electronics at the Faculty of Electrical Engineering and Information Technologies (FIET), Skopje, Macedonia. Her research interests include, semiconductor physics, semiconductor device modeling and modelling devices on a circuit level. She has published more than 80 scientific publications in scientific journals and conference proceedings and several book chapters.
Abdul Rawoof Shaik is currently pursuing a PhD at Arizona State University working on modelling defect migration in cadmium telluride solar cells. He has co-authored four conference papers and two book chapters about thermal modelling of nanoscale devices during his master's thesis work.
Dragica Vasileska is a Professor of Electrical Engineering at Arizona State University. She is a Senior Member of both IEEE and APS and has published more than 180 publications in journals, over 200 conference proceedings refereed papers, dozens of book chapters, and is co-author of two books. She received the 1998 NSF Career Award.
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Buch. Zustand: Neu. Neuware - It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance. Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile. Artikel-Nr. 9781643278087
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