Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects-their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.
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Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
Paperback. Zustand: Brand New. 1st edition. 692 pages. 9.00x6.00x1.61 inches. In Stock. Artikel-Nr. zk149330173X
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Anbieter: Bookbot, Prague, Tschechien
Softcover. Zustand: Fine. Leichte Kratzer / Abnutzungen / Druckstellen; Gebrochener Buchrücken; Farbtonänderung. This book serves as a valuable reference for reliability professionals and a text for advanced undergraduate or graduate students, introducing the extensive reliability literature related to microelectronic and electronic devices. It addresses chip and packaging level failures, linking them to atomic mechanisms and models that explain degradation, alongside the statistical analysis of lifetime data. Key failure mechanisms discussed include electromigration, dielectric radiation damage, and mechanical failures of contacts and solder joints. A central theme is the relationship between product defects, yield, and reliability, emphasizing their role in failures and methods for experimental exposure. Readers will enhance their understanding of failure mechanisms in electronic materials and devices, develop skills in the mathematical handling of reliability data, and gain insights into future technology trends and associated reliability challenges. Key features include discussions on reliability and failure at both chip and packaging levels, the impact of defects on yield and reliability, a tutorial on reliability mathematics, and a focus on various failure mechanisms and defect detection methods. Artikel-Nr. f5153b5b-34c0-46fd-a23f-f8cbf2493b8d
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Anbieter: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, Deutschland
Zustand: gut. 1998. Reliability and Failure of Electronic Materials and Devices pages. Artikel-Nr. BN108971
Anzahl: 1 verfügbar