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Electronic Packaging for High Reliability, Low Cost Electronics: 57 (NATO Science Partnership Subseries: 3) - Hardcover
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Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
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Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
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Electronic Packaging for High Reliability, Low Cost Electronics
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Springer Netherlands, Springer Netherlands, 2000
ISBN 10: 0792352181
ISBN 13: 9780792352181
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. Artikel-Nr. 9780792352181
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Electronic Packaging for High Reliability, Low Cost Electronics
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Zustand: New. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360. . 2000. Hardback. . . . . Books ship from the US and Ireland. Artikel-Nr. V9780792352181
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