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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57, Band 57) - Hardcover

 
9780792352181: Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57, Band 57)
Hardcover
ISBN 10: 0792352181 ISBN 13: 9780792352181
Verlag: Springer, 2000

Inhaltsangabe

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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Von der hinteren Coverseite

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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Verlag
Springer
Erscheinungsdatum
2000
Sprache
Englisch
ISBN 10 
0792352181
ISBN 13 
9780792352181
Einband
Gebundene Ausgabe
Anzahl der Seiten
306
Herausgeber
Tummala R.R., Kosec Marija, Jones W.K., Belavic Darko
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