Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging
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Anbieter: BooksRun, Philadelphia, PA, USA
Hardcover. Zustand: Fair. 1. With dust jacket. The item might be beaten up but readable. May contain markings or highlighting, as well as stains, bent corners, or any other major defect, but the text is not obscured in any way. Artikel-Nr. 0442205783-7-1-29
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Anbieter: Better World Books, Mishawaka, IN, USA
Zustand: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Artikel-Nr. 8122973-6
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Anbieter: A Squared Books (Don Dewhirst), South Lyon, MI, USA
Hardcover. Zustand: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book. Artikel-Nr. SKU1149536
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Anbieter: WeBuyBooks, Rossendale, LANCS, Vereinigtes Königreich
Zustand: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to the page edges/pages . Previous owners name inside the front page/cover. Artikel-Nr. rev2723883316
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