Inhaltsangabe
Proven 2D and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:
2D and 3D IC lead-free interconnects
CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
Lead-free (SACX) solder joints
Low-temperature lead-free (SnBiAg) solder joints
Solder joints with voids, high strain rate, and high ramp rate
VCSEL and LED lead-free interconnects
3D LED and 3D MEMS with TSVs
Chip-to-wafer (C2W) bonding and lead-free interconnects
Wafer-to-wafer (W2W) bonding and lead-free interconnects
3D IC chip stacking with low-temperature bonding
TSV interposers and lead-free interconnects
Electromigration of lead-free microbumps for 3D IC integration
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Über die Autorin bzw. den Autor
John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, Industrial Technology Research Institute (ITRI), Taiwan. He has published 15 books with McGraw-Hill, including Advanced MEMS Packaging, Electronics Manufacturing with Lead-Free Solders and Low Cost Flip Chip Technologies.
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Reliability Of Rohs-compliant 2d And 3d Ic Interconnects
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects
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Buch. Zustand: Neu. Neuware - Proven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.Covers reliability of: 2D and 3D IC lead-free interconnectsCCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder jointsLead-free (SACX) solder jointsLow-temperature lead-free (SnBiAg) solder jointsSolder joints with voids, high strain rate, and high ramp rateVCSEL and LED lead-free interconnects3D LED and 3D MEMS with TSVsChip-to-wafer (C2W) bonding and lead-free interconnectsWafer-to-wafer (W2W) bonding and lead-free interconnects3D IC chip stacking with low-temperature bondingTSV interposers and lead-free interconnectsElectromigration of lead-free microbumps for 3D IC integration. Artikel-Nr. 9780071753791
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