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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
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Über die Autorin bzw. den Autor
Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
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System on Package: Miniaturization of the Entire System
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Gebunden. Zustand: New. System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packag. Artikel-Nr. 594341711
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System on Package : Miniaturization of the Entire System
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Buch. Zustand: Neu. Neuware - System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where 'systems' used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. Artikel-Nr. 9780071459068
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