Verwandte Artikel zu Fundamentals of Power Integrity for Computer Platforms...

Fundamentals of Power Integrity for Computer Platforms and Systems - Hardcover

 
9781118091432: Fundamentals of Power Integrity for Computer Platforms and Systems
Alle Exemplare der Ausgabe mit dieser ISBN anzeigen:
 
 
AN ALL–ENCOMPASSING TEXT THAT FOCUSES ON THE FUNDAMENTALS OF POWER INTEGRITY POWER INTEGRITY IS THE STUDY OF POWER DISTRIBUTION FROM THE SOURCE TO THE LOAD AND THE SYSTEM LEVEL ISSUES THAT CAN OCCUR ACROSS IT. FOR COMPUTER SYSTEMS, THESE ISSUES CAN RANGE FROM INSIDE THE SILICON TO ACROSS THE BOARD AND MAY EGRESS INTO OTHER PARTS OF THE PLATFORM, INCLUDING THERMAL, EMI, AND MECHANICAL. WITH A FOCUS ON COMPUTER SYSTEMS AND SILICON LEVEL POWER DELIVERY, THIS BOOK SHEDS LIGHT ON THE FUNDAMENTALS OF POWER INTEGRITY, UTILIZING THE AUTHOR S EXTENSIVE BACKGROUND IN THE POWER INTEGRITY INDUSTRY AND UNIQUE EXPERIENCE IN SILICON POWER ARCHITECTURE, DESIGN, AND DEVELOPMENT. AIMED AT ENGINEERS INTERESTED IN LEARNING THE ESSENTIAL AND ADVANCED TOPICS OF THE FIELD, THIS BOOK OFFERS IMPORTANT CHAPTER COVERAGE OF FUNDAMENTALS IN POWER DISTRIBUTION, POWER INTEGRITY ANALYSIS BASICS, SYSTEM–LEVEL POWER INTEGRITY CONSIDERATIONS, POWER CONVERSION IN COMPUTER SYSTEMS, CHIP–LEVEL POWER, AND MORE. FUNDAMENTALS OF POWER INTEGRITY FOR COMPUTER PLATFORMS AND SYSTEMS: INTRODUCES READERS TO BOTH THE FIELD OF POWER INTEGRITY AND TO PLATFORM POWER CONVERSION PROVIDES A UNIQUE FOCUS ON COMPUTER SYSTEMS AND SILICON LEVEL POWER DELIVERY UNAVAILABLE ELSEWHERE OFFERS DETAILED ANALYSIS OF COMMON PROBLEMS IN THE INDUSTRY REVIEWS ELECTROMAGNETIC FIELD AND CIRCUIT REPRESENTATION INCLUDES A DETAILED BIBLIOGRAPHY OF REFERENCES AT THE END OF EACH CHAPTER WORKS OUT MULTIPLE EXAMPLE PROBLEMS WITHIN EACH CHAPTER INCLUDING ADDITIONAL APPENDIXES OF TABLES AND FORMULAS, FUNDAMENTALS OF POWER INTEGRITY FOR COMPUTER PLATFORMS AND SYSTEMS IS AN IDEAL INTRODUCTORY TEXT FOR ENGINEERS OF POWER INTEGRITY AS WELL AS THOSE IN THE CHIP DESIGN INDUSTRY, SPECIFICALLY PHYSICAL DESIGN AND PACKAGING.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Reseña del editor:
An all-encompassing text that focuses on the fundamentals of power integrity Power integrity is the study of power distribution from the source to the load and the system level issues that can occur across it. For computer systems, these issues can range from inside the silicon to across the board and may egress into other parts of the platform, including thermal, EMI, and mechanical. With a focus on computer systems and silicon level power delivery, this book sheds light on the fundamentals of power integrity, utilizing the author s extensive background in the power integrity industry and unique experience in silicon power architecture, design, and development. Aimed at engineers interested in learning the essential and advanced topics of the field, this book offers important chapter coverage of fundamentals in power distribution, power integrity analysis basics, system-level power integrity considerations, power conversion in computer systems, chip-level power, and more. Fundamentals of Power Integrity for Computer Platforms and Systems: * Introduces readers to both the field of power integrity and to platform power conversion * Provides a unique focus on computer systems and silicon level power delivery unavailable elsewhere * Offers detailed analysis of common problems in the industry * Reviews electromagnetic field and circuit representation * Includes a detailed bibliography of references at the end of each chapter * Works out multiple example problems within each chapter Including additional appendixes of tables and formulas, Fundamentals of Power Integrity for Computer Platforms and Systems is an ideal introductory text for engineers of power integrity as well as those in the chip design industry, specifically physical design and packaging.
Biografía del autor:
J. TED DIBENE II, PhD, is a Senior Power Architect at Intel Corporation. His main focus is in the area of power management and power delivery for advanced microprocessors, SoC s, and other silicon devices. Prior to joining Intel, Dr. DiBene held the position of CTO at INCEP Technologies Inc., which he cofounded in 1999.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

  • VerlagJohn Wiley & Sons Inc
  • Erscheinungsdatum2014
  • ISBN 10 1118091434
  • ISBN 13 9781118091432
  • EinbandTapa dura
  • Anzahl der Seiten280

Versand: EUR 5,26
Von Vereinigtes Königreich nach USA

Versandziele, Kosten & Dauer

In den Warenkorb

Beste Suchergebnisse beim ZVAB

Beispielbild für diese ISBN

J. Ted DiBene
ISBN 10: 1118091434 ISBN 13: 9781118091432
Neu Hardcover Anzahl: > 20
Anbieter:
Blackwell's
(London, Vereinigtes Königreich)
Bewertung

Buchbeschreibung hardback. Zustand: New. Language: ENG. Artikel-Nr. 9781118091432

Weitere Informationen zu diesem Verkäufer | Verkäufer kontaktieren

Neu kaufen
EUR 140,75
Währung umrechnen

In den Warenkorb

Versand: EUR 5,26
Von Vereinigtes Königreich nach USA
Versandziele, Kosten & Dauer
Foto des Verkäufers

Joseph T. DiBene
Verlag: John Wiley & Sons (2014)
ISBN 10: 1118091434 ISBN 13: 9781118091432
Neu Hardcover Anzahl: 3
Anbieter:
moluna
(Greven, Deutschland)
Bewertung

Buchbeschreibung Gebunden. Zustand: New. J. TED DIBENE II, PhD, is a Senior Power Architect at Intel Corporation. His main focus is in the area of power management and power delivery for advanced microprocessors, SoC s, and other silicon devices. Prior to joining Intel, Dr. DiBene held the positio. Artikel-Nr. 556566234

Weitere Informationen zu diesem Verkäufer | Verkäufer kontaktieren

Neu kaufen
EUR 121,97
Währung umrechnen

In den Warenkorb

Versand: EUR 48,99
Von Deutschland nach USA
Versandziele, Kosten & Dauer