Verwandte Artikel zu VLSI Placement and Global Routing Using Simulated Annealing:...

VLSI Placement and Global Routing Using Simulated Annealing: 54 (The Springer International Series in Engineering and Computer Science) - Hardcover

 
9780898382815: VLSI Placement and Global Routing Using Simulated Annealing: 54 (The Springer International Series in Engineering and Computer Science)
Alle Exemplare der Ausgabe mit dieser ISBN anzeigen:
 
 
Book by Sechen Carl

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Reseña del editor:
From my B.E.E degree at the University of Minnesota and right through my S.M. degree at M.I.T., I had specialized in solid state devices and microelectronics. I made the decision to switch to computer-aided design (CAD) in 1981, only a year or so prior to the introduction of the simulated annealing algorithm by Scott Kirkpatrick, Dan Gelatt, and Mario Vecchi of the IBM Thomas 1. Watson Research Center. Because Prof. Alberto Sangiovanni-Vincentelli, my UC Berkeley advisor, had been a consultant at IBM, I re­ ceived a copy of the original IBM internal report on simulated annealing approximately the day of its release. Given my background in statistical mechanics and solid state physics, I was immediately impressed by this new combinatorial optimization technique. As Prof. Sangiovanni-Vincentelli had suggested I work in the areas of placement and routing, it was in these realms that I sought to explore this new algorithm. My flJ'St implementation of simulated annealing was for an island-style gate array placement problem. This work is presented in the Appendix of this book. I was quite struck by the effect of a nonzero temperature on what otherwise appears to be a random in­ terchange algorithm.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

  • VerlagSpringer
  • Erscheinungsdatum1988
  • ISBN 10 0898382815
  • ISBN 13 9780898382815
  • EinbandTapa dura
  • Anzahl der Seiten308

Versand: EUR 32,99
Von Deutschland nach USA

Versandziele, Kosten & Dauer

In den Warenkorb

Weitere beliebte Ausgaben desselben Titels

9781461289579: Vlsi Placement and Global Routing Using Simulated Annealing: 54 (The Springer International Series in Engineering and Computer Science)

Vorgestellte Ausgabe

ISBN 10:  1461289572 ISBN 13:  9781461289579
Verlag: Springer, 2013
Softcover

Beste Suchergebnisse beim ZVAB

Foto des Verkäufers

Carl Sechen
Verlag: Springer US (1988)
ISBN 10: 0898382815 ISBN 13: 9780898382815
Neu Hardcover Anzahl: 1
Anbieter:
AHA-BUCH GmbH
(Einbeck, Deutschland)
Bewertung

Buchbeschreibung Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - From my B.E.E degree at the University of Minnesota and right through my S.M. degree at M.I.T., I had specialized in solid state devices and microelectronics. I made the decision to switch to computer-aided design (CAD) in 1981, only a year or so prior to the introduction of the simulated annealing algorithm by Scott Kirkpatrick, Dan Gelatt, and Mario Vecchi of the IBM Thomas 1. Watson Research Center. Because Prof. Alberto Sangiovanni-Vincentelli, my UC Berkeley advisor, had been a consultant at IBM, I re ceived a copy of the original IBM internal report on simulated annealing approximately the day of its release. Given my background in statistical mechanics and solid state physics, I was immediately impressed by this new combinatorial optimization technique. As Prof. Sangiovanni-Vincentelli had suggested I work in the areas of placement and routing, it was in these realms that I sought to explore this new algorithm. My flJ'St implementation of simulated annealing was for an island-style gate array placement problem. This work is presented in the Appendix of this book. I was quite struck by the effect of a nonzero temperature on what otherwise appears to be a random in terchange algorithm. Artikel-Nr. 9780898382815

Weitere Informationen zu diesem Verkäufer | Verkäufer kontaktieren

Neu kaufen
EUR 168,27
Währung umrechnen

In den Warenkorb

Versand: EUR 32,99
Von Deutschland nach USA
Versandziele, Kosten & Dauer