Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Bestandsnummer des Verk�ufers ABE-1705620059280

Verk�ufer kontaktieren

Diesen Artikel melden

Bibliografische Details

Titel: 3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Verlag: Springer
Erscheinungsjahr: 2017
Sprache: Englisch
ISBN-10: 3319445847
ISBN-13: 9783319445847
Einband: Hardcover
Auflage: 1. Auflage
Zustand: Sehr gut

�ber diesen Titel

Inhaltsangabe

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Von der hinteren Coverseite

Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages
Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis
Features contributions from both academic and industry authors, for a complete view of this important technology

��ber diesen Titel� kann sich auf eine andere Ausgabe dieses Titels beziehen.

Anbieterinformationen

Kleines Gesch�ft mit verschiedenen Rarit�ten; ungew�hnliche B�cher, antiquarische B�cher, englische B�cher.

Zur Homepage des Verk�ufers

Unternehmensdaten des Verk�ufers

Homeless Books
Germany

Gesch�ftsbedingungen und Versandinformationen

Verkaufsbedingungen

Die Preise in die Liste sind in Euro angegeben, im Preis ist die gesetzliche Umsatzsteuer enthalten. Die Bestellungen - per E-Mail, Telephon oder Post - werden als verbindlich angesehen und in der Reihenfolge ihres Eintreffens bearbeitet (bitte die Postadresse anzugeben nicht vergessen).
Falls das Bestellte nicht mehr verf�gbar ist, wird der Kunde unverz�glich informiert.
Der Zustand der B�cher wurde nach M�glichkeit sorgf�ltig beschrieben und stets im Preis ber�cksichtigt.