Springer us okt 1992 (3 Ergebnisse)

Buch. Zustand: Neu. Neuware - Moore's law [Noy77], which predicted that the number of devices in tegrated on a chip would be doubled every two years, was accurate for a number of years. Only recently has the level of integration be gun to slow down somewhat due to the physical limits of integration technology. Advances in silicon technology have allowed Ie design ers to integrate more than a few million transistors on a chip; even a whole system of moderate complexity can now be implemented on a single chip. To keep pace with the increasing complexity in very large scale integrated (VLSI) circuits, the productivity of chip designers would have to increase at the same rate as the level of integration. Without such an increase in productivity, the design of complex systems might not be achievable within a reasonable time-frame. The rapidly increasing complexity of VLSI circuits has made de- 1 2 INTRODUCTION sign automation an absolute necessity, since the required increase in productivity can only be accomplished with the use of sophisticated design tools. Such tools also enable designers to perform trade-off analyses of different logic implementations and to make well-informed design decisions.…

Buch. Zustand: Neu. Neuware - Matrix Computations on Systolic-Type Arrays provides a framework which permits a good understanding of the features and limitations of processor arrays for matrix algorithms. It describes the tradeoffs among the characteristics of these systems, such as internal storage and communication bandwidth, and the impact on overall performance and cost. A system which allows for the analysis of methods for the design/mapping of matrix algorithms is also presented. This method identifies stages in the design/mapping process and the capabilities required at each stage. Matrix Computations on Systolic-Type Arrays provides a much needed description of the area of processor arrays for matrix algorithms and of the methods used to derive those arrays. The ideas developed here reduce the space of solutions in the design/mapping process by establishing clear criteria to select among possible options as well as by a-priori rejection of alternatives which are not adequate (but which are considered in other approaches). The end result is a method which is more specific than other techniques previously available (suitable for a class of matrix algorithms) but which is more systematic, better defined and more effective in reaching the desired objectives. Matrix Computations on Systolic-Type Arrays will interest researchers and professionals who are looking for systematic mechanisms to implement matrix algorithms either as algorithm-specific structures or using specialized architectures. It provides tools that simplify the design/mapping process without introducing degradation, and that permit tradeoffs between performance/cost measures selected by the designer.…

Taschenbuch. Zustand: Neu. Neuware - Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.…