Wireless communications circuits systems (23 Ergebnisse)

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Sprache: Englisch
Verlag: Springer 2009
Serie: Integrated Circuits and Systems, Buch 19 von 34. Buch 19 von 34 - Integrated Circuits and Systems
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Verlag: The Institution of Engineering and Technology 2003
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Zustand: Gut. Zustand: Gut | Seiten: 304 | Sprache: Englisch | Produktart: Bücher | This book examines integrated circuits, systems and transceivers for wireless and mobile communications. It covers the most recent developments in key RF, IF, analogue, mixed-signal components and single-chip transceivers in CMOS technology.
Weitere BilderSprache: Englisch
Verlag: Springer 2010
Serie: Integrated Circuits and Systems, Buch 19 von 34. Buch 19 von 34 - Integrated Circuits and Systems
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Taschenbuch. Zustand: Neu. Circuits and Systems for Future Generations of Wireless Communications | Aleksandar Tasic (u. a.) | Taschenbuch | viii | Englisch | 2010 | Springer | EAN 9789048182220 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]co…m | Anbieter: preigu.

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Zustand: Gut. Zustand: Gut | Seiten: 408 | Sprache: Englisch | Produktart: Bücher | Thisbook contains revised contributions byt he speakers oft he 1s t IEEE Workshop on Wireless Communication Circuits andSystems, held in Lucerne, Switzerland, from June 22¿24, 1998. The aim oft he workshop was to apply the vast expertise oft he C…AS Society in the area of circuit and systemdesign to therapidly growing field of wireless communications. Theworkshop combined presentations by invited experts from academia and industry with panel and informal discussions. The following topics were covered: RFSystemInteg ration (single chip systems, CM OS RF circuits), RFFront End Circuits (CMOS RF oscillators, broadband design techniques), Wideband Conversion for Software Radio (A/D conversion issues, wideband sub sampling, low spurious A/D conversion), Process Technologies for Future RF Systems (Si, SiGe, GaAs, CMOS, packaging technologies), DSPforWireless Communications (DSP algorithms, fixed point systems, DSP for baseband applications), Blind Channel Equalization (adaptive interference suppression, design techniques, channel estimation). The workshop was a great success, with over 130 participants from 19 countries, from the U. S. to Europe and Asia, including a large contingent of participants from industry (60% ). Feedback from the participants showed that the carefully selected combination oftutorial like lectures with lectures onspecialized and advancedtopics was a feature oft he workshop that was particularly a ppreciated. Duet o therelatively strong involvemento findustry ¿ both in theform of lecturers and listeners ¿ a high level ofd i scussion was attained in bothpanel sessions and informal gatherings.

Sprache: Englisch
Verlag: Springer Netherlands, Springer 2010
Serie: Integrated Circuits and Systems, Buch 19 von 34. Buch 19 von 34 - Integrated Circuits and Systems
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The idea for this book originated from a Special Session on Circuits and Systems for Future Generations of Wireless Communications that was presented at the 2005 InternationalSymposiumon Circuits and Systems, which was then followed by two Special Is…sues bearing the same title that appeared in the March and April 2008 issues of the IEEE Transactions on Circuits and Systems - Part II: Express Briefs. Out of a large number of great contributions, we have selected those tting best the book format based on their quality. We would like to thank all the authors, the reviewers of the Transactions on Circuits and Systems - Part II, and the reviewers of the nal book material for their efforts in creating this manuscript. We also thank the Springer Editorial Staff for their support in putting together all the good work. We hope that this book will provide you, the reader, with new insights into Circuits and Systems for Future Generations of Wireless Communications.

Sprache: Englisch
Verlag: Springer 2009
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The idea for this book originated from a Special Session on Circuits and Systems for Future Generations of Wireless Communications that was presented at the 2005 InternationalSymposiumon Circuits and Systems, which was then followed by two Special Issues be…aring the same title that appeared in the March and April 2008 issues of the IEEE Transactions on Circuits and Systems - Part II: Express Briefs. Out of a large number of great contributions, we have selected those tting best the book format based on their quality. We would like to thank all the authors, the reviewers of the Transactions on Circuits and Systems - Part II, and the reviewers of the nal book material for their efforts in creating this manuscript. We also thank the Springer Editorial Staff for their support in putting together all the good work. We hope that this book will provide you, the reader, with new insights into Circuits and Systems for Future Generations of Wireless Communications.

Sprache: Englisch
Verlag: Springer Nature B.V. 2009
Serie: Integrated Circuits and Systems, Buch 19 von 34. Buch 19 von 34 - Integrated Circuits and Systems
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Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 316 | Sprache: Englisch | Produktart: Bücher | The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of both today… and the future will have not only to allow for a variety of applications, supporting the transfer of characters, audio, graphics, and video data, but they will also have to maintain connection with many other devices rather than with a single base station, in a variety of environments. Moreover, to provide various services from different wireless communication standards with higher capacities and higher data-rates, fully integrated and multifunctional wireless devices will be required.Multifunctional circuits and systems can be made profitable by a large scale of integration, elimination of external components, reduction of silicon area, and extensive reuse of resources. Integration of (Bi)CMOS transceiver RF front-end and analog baseband circuits with computing CMOS circuits on the same silicon chip further reduces costs of multifunctional mobile devices.However, as batteries continue to determine the lifetime and size of mobile equipment, further extension of capabilities of wearable and wireless devices will depend critically on the integrated circuits and systems solutions.The demand for multifunctional and multi-mode wireless-capable devices is accompanied by many significant challenges at system, circuit, and technology levels.In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed.

Sprache: Englisch
Verlag: Springer Nature B.V. 2009
Serie: Integrated Circuits and Systems, Buch 19 von 34. Buch 19 von 34 - Integrated Circuits and Systems
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Zustand: Hervorragend. Zustand: Hervorragend | Seiten: 316 | Sprache: Englisch | Produktart: Bücher | The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of bo…th today and the future will have not only to allow for a variety of applications, supporting the transfer of characters, audio, graphics, and video data, but they will also have to maintain connection with many other devices rather than with a single base station, in a variety of environments. Moreover, to provide various services from different wireless communication standards with higher capacities and higher data-rates, fully integrated and multifunctional wireless devices will be required.Multifunctional circuits and systems can be made profitable by a large scale of integration, elimination of external components, reduction of silicon area, and extensive reuse of resources. Integration of (Bi)CMOS transceiver RF front-end and analog baseband circuits with computing CMOS circuits on the same silicon chip further reduces costs of multifunctional mobile devices.However, as batteries continue to determine the lifetime and size of mobile equipment, further extension of capabilities of wearable and wireless devices will depend critically on the integrated circuits and systems solutions.The demand for multifunctional and multi-mode wireless-capable devices is accompanied by many significant challenges at system, circuit, and technology levels.In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed.

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Zustand: New. Über den AutorYichuang Sun is Professor at the University of Hertfordshire, UK. His research interests are in analogue and mixed-signal circuits, RF and communication circuits, circuit testing and fault diagnosis, coding and signal .

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Hardcover. Zustand: gut. 2003. Wireless Communications Circuits and Systems In deutscher Sprache. pages.

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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thisbook contains revised contributions byt he speakers oft he 1s t IEEE Workshop on Wireless Communication Circuits andSystems, held in Lucerne, Switzerland, from June 22 24, 1998. The aim oft he workshop was to apply the vast expertise oft he CAS Society…in the area of circuit and systemdesign to therapidly growing field of wireless communications. Theworkshop combined presentations by invited experts from academia and industry with panel and informal discussions. The following topics were covered: RFSystemInteg ration (single chip systems, CM OS RF circuits), RFFront End Circuits (CMOS RF oscillators, broadband design techniques), Wideband Conversion for Software Radio (A/D conversion issues, wideband sub sampling, low spurious A/D conversion), Process Technologies for Future RF Systems (Si, SiGe, GaAs, CMOS, packaging technologies), DSPforWireless Communications (DSP algorithms, fixed point systems, DSP for baseband applications), Blind Channel Equalization (adaptive interference suppression, design techniques, channel estimation). The workshop was a great success, with over 130 participants from 19 countries, from the U. S. to Europe and Asia, including a large contingent of participants from industry (60% ). Feedback from the participants showed that the carefully selected combination oftutorial like lectures with lectures onspecialized and advancedtopics was a feature oft he workshop that was particularly a ppreciated. Duet o therelatively strong involvemento findustry both in theform of lecturers and listeners a high level ofd i scussion was attained in bothpanel sessions and informal gatherings.

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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thisbook contains revised contributions byt he speakers oft he 1s t IEEE Workshop on Wireless Communication Circuits andSystems, held in Lucerne, Switzerland, from June 22 24, 1998. The aim oft he workshop was to apply the vast expertise oft he CAS S…ociety in the area of circuit and systemdesign to therapidly growing field of wireless communications. Theworkshop combined presentations by invited experts from academia and industry with panel and informal discussions. The following topics were covered: RFSystemInteg ration (single chip systems, CM OS RF circuits), RFFront End Circuits (CMOS RF oscillators, broadband design techniques), Wideband Conversion for Software Radio (A/D conversion issues, wideband sub sampling, low spurious A/D conversion), Process Technologies for Future RF Systems (Si, SiGe, GaAs, CMOS, packaging technologies), DSPforWireless Communications (DSP algorithms, fixed point systems, DSP for baseband applications), Blind Channel Equalization (adaptive interference suppression, design techniques, channel estimation). The workshop was a great success, with over 130 participants from 19 countries, from the U. S. to Europe and Asia, including a large contingent of participants from industry (60% ). Feedback from the participants showed that the carefully selected combination oftutorial like lectures with lectures onspecialized and advancedtopics was a feature oft he workshop that was particularly a ppreciated. Duet o therelatively strong involvemento findustry both in theform of lecturers and listeners a high level ofd i scussion was attained in bothpanel sessions and informal gatherings.

Sprache: Englisch
Verlag: Institution Of Engineering & Technology Nov 2003 2003
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Buch. Zustand: Neu. Neuware - This book examines integrated circuits, systems and transceivers for wireless and mobile communications. It covers the most recent developments in key RF, IF, analogue, mixed-signal components and single-chip transceivers in CMOS technology.

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Zustand: New. Based on the 1st IEEE Workshop on Wireless Communication Circuits and Systems, this book covers topics such as: RF System Integration, RF Front-End Circuits, Wideband Conversion for Software Radio, Process Technologies for Future RF Systems, DSP for Wireless Communications, and, Blind Channel Equalization. Editor(s…): Helfenstein, Markus; Moschytz, George S. Num Pages: 388 pages, biography. BIC Classification: TJFC; TJKR. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 235 x 155 x 23. Weight in Grams: 747. . 1999. Hardback. . . . . Books ship from the US and Ireland.