vlsi systems chip ifip (34 Ergebnisse)

Zustand: Good. *Price HAS BEEN REDUCED by 10% until Monday, June 8 (weekend SALE item)* 678 pp., Hardcover, ex library, else text and binding clean and tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.

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Paperback. Zustand: Brand New. revised edition. 200 pages. 9.25x6.10x0.46 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

Taschenbuch. Zustand: Neu. VLSI-SoC: The Advanced Research for Systems on Chip | 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, Hong Kong, China, October 3-5, 2011, Revised Selected Papers | Salvador Mir (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | x | Englisch | 2014 | Springer | EAN 9783642445095 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

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Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 344 | Sprache: Englisch | Produktart: Bücher | International Federation for Information ProcessingThe IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication.  The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction.  Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured.  These results often precede journal publication and represent the most current research.  The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing. For more information about the 300 other books in the IFIP series, please visit [LINK ENTFERNT] more information about IFIP, please visit [LINK ENTFERNT].

gebundene Ausgabe. Zustand: Gut. 477 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 800.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 314 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

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Paperback. Zustand: Brand New. 316 pages. 9.00x6.00x0.74 inches. In Stock.

Paperback. Zustand: Brand New. 354 pages. 9.25x6.25x0.75 inches. In Stock.

Taschenbuch. Zustand: Neu. VLSI-SOC: From Systems to Chips | IFIP TC 10/WG 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip (VLSI-SoC 2003), December 1-3, 2003, Darmstadt, Germany | Manfred Glesner (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer | EAN 9781441941268 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. VLSI-SoC: From Systems to Silicon | IFIP TC10/ WG 10.5 Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC2005), October 17-19, 2005, Perth, Australia | Ricardo Reis (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | x | Englisch | 2010 | Springer | EAN 9781441944672 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Hardcover. Zustand: Brand New. 1st edition. 344 pages. 9.25x6.25x1.00 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12\* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD conference. The 13th conference was held at the Parmelia Hilton Hotel, Perth, Western Australia (October 17-19, 2005). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier and Darmstadt. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show industrial and academic research results in the field of mic- electronics design. The current trend toward increasing chip integ- tion and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SOC conferences aim to address these exciting new issues. The 2005 edition of VLSI-SoC maintained the traditional structure, which has been successful at the previous VLSI-SOC conferences. The quality of submissions (107 papers from 26 countries) made the selection process difficult, but finally 63 papers and 25 posters were accepted for presentation in VLSI-SoC 2005. Out of the 63 full papers presented at the conference, 20 were chosen by a selection committee to have an extended and revised version included in this book. These selected papers came from Australia, Brazil, France, Germany, Italy, Korea, Portugal, Sweden, Switzerland, United Kingdom and the United States of America. x Preface.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD conference. The 13th conference was held at the Parmelia Hilton Hotel, Perth, Western Australia (October 17-19, 2005). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier and Darmstadt. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show industrial and academic research results in the field of mic- electronics design. The current trend toward increasing chip integ- tion and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SOC conferences aim to address these exciting new issues. The 2005 edition of VLSI-SoC maintained the traditional structure, which has been successful at the previous VLSI-SOC conferences. The quality of submissions (107 papers from 26 countries) made the selection process difficult, but finally 63 papers and 25 posters were accepted for presentation in VLSI-SoC 2005. Out of the 63 full papers presented at the conference, 20 were chosen by a selection committee to have an extended and revised version included in this book. These selected papers came from Australia, Brazil, France, Germany, Italy, Korea, Portugal, Sweden, Switzerland, United Kingdom and the United States of America. x Preface.

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Taschenbuch. Zustand: Neu. SOC Design Methodologies | IFIP TC10 / WG10.5 Eleventh International Conference on Very Large Scale Integration of Systems-on-Chip (VLSI-SOC'01) December 3-5, 2001, Montpellier, France | Michel Robert (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | xx | Englisch | 2013 | Springer | EAN 9781475765304 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. VLSI: Systems on a Chip | IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI '99) December 1-4, 1999, Lisboa, Portugal | Luis Miguel Silveira (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | xxii | Englisch | 2013 | Springer | EAN 9781475710144 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The 11 th IFIP International Conference on Very Large Scale Integration, in Montpellier, France, December 3-5,2001, was a great success. The main focus was about IP Cores, Circuits and System Designs & Applications as well as SOC Design Methods and CAD. This book contains the best papers (39 among 70) that have been presented during the conference. Those papers deal with all aspects of importance for the design of the current and future integrated systems. System on Chip (SOC) design is today a big challenge for designers, as a SOC may contain very different blocks, such as microcontrollers, DSPs, memories including embedded DRAM, analog, FPGA, RF front-ends for wireless communications and integrated sensors. The complete design of such chips, in very deep submicron technologies down to 0.13 mm, with several hundreds of millions of transistors, supplied at less than 1 Volt, is a very challenging task if design, verification, debug and industrial test are considered. The microelectronic revolution is fascinating; 55 years ago, in late 1947, the transistor was invented, and everybody knows that it was by William Shockley, John Bardeen and Walter H. Brattein, Bell Telephone Laboratories, which received the Nobel Prize in Physics in 1956. Probably, everybody thinks that it was recognized immediately as a major invention.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - For over three decades now, silicon capacity has steadily been doubling every year and a half with equally staggering improvements continuously being observed in operating speeds. This increase in capacity has allowed for more complex systems to be built on a single silicon chip. Coupled with this functionality increase, speed improvements have fueled tremendous advancements in computing and have enabled new multi-media applications. Such trends, aimed at integrating higher levels of circuit functionality are tightly related to an emphasis on compactness in consumer electronic products and a widespread growth and interest in wireless communications and products. These trends are expected to persist for some time as technology and design methodologies continue to evolve and the era of Systems on a Chip has definitely come of age. While technology improvements and spiraling silicon capacity allow designers to pack more functions onto a single piece of silicon, they also highlight a pressing challenge for system designers to keep up with such amazing complexity. To handle higher operating speeds and the constraints of portability and connectivity, new circuit techniques have appeared. Intensive research and progress in EDA tools, design methodologies and techniques is required to empower designers with the ability to make efficient use of the potential offered by this increasing silicon capacity and complexity and to enable them to design, test, verify and build such systems.