Zustand: Muy bueno. : Este libro recopila los trabajos revisados y seleccionados de la 17ª Conferencia Internacional IFIP WG 10.5/IEEE sobre Integración a Muy Gran Escala (VLSI-SoC 2009), celebrada en Florianópolis, Brasil, del 12 al 15 de octubre de 2009. El libro aborda las tecnologías para la integración de sistemas. EAN: 9783642270727 Tipo: Libros Categoría: Tecnología Título: VLSI-Soc - Technologies for Systems Integration Autor: Ricardo Reis| Jürgen Becker| Marcelo De Oliveira Johann Idioma: eng Páginas: 202.
Sprache: Englisch
Verlag: Springer-Verlag New York Inc, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 77,43
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 2011 edition. 197 pages. 9.25x6.25x0.50 inches. In Stock.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 83,34
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. 2011 edition. 223 pages. 9.10x6.10x0.60 inches. In Stock.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 90,21
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Sprache: Englisch
Verlag: Springer Berlin Heidelberg, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Sprache: Englisch
Verlag: Springer Berlin Heidelberg, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Taschenbuch. Zustand: Neu. VLSI-SoC: Technologies for Systems Integration | 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, Florianópolis, Brazil, October 12-15, 2009, Revised Selected Papers | Jürgen Becker (u. a.) | Taschenbuch | x | Englisch | 2013 | Springer | EAN 9783642270727 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.