Very large scale integration (159 Ergebnisse)

Hardback. Zustand: Good.

Hardback. Zustand: Very Good.

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,900grams, ISBN:0914894951. …

paperback. Zustand: Very Good. No Dust Jacket. No Earlier Edition Stated. Slight shelf wear. Clean Copy.

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:0132019302.

Zustand: Good. Light marks to the cover on both sides. Inscription to the inside cover and a front page. Content is fine to read.

Hardcover. Zustand: Near Fine. 1st Edition. Xii, 430 Pp. Illustrated Boards. First Printing. Slight Usage, No Marks. Near Fine.

XIV, 255 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. IFIP Advances in Information and Communication Technology, Vol. 500. Sprache: Englisch.…

Ill., graph. Darst. XV, 270 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch. …

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Hardcover. Zustand: Gut. 2., corr. and updated ed. X, 302 S. Ex-library in GOOD condition with library-signature and stamp(s). Some traces of use. Ehem. Bibliotheksexemplar mit Signatur und Stempel. GUTER Zustand, ein paar Gebrauchsspuren. R-17278 3540113681 Sprache: Englisch Gewicht in Gramm: 550.

Hardcover. 495 p. Good condition. The pages are clean and without markings. Slight signs of storage and use. Retired library copy with corresponding markings. Otherwise, a neat copy. 9780914894957 Sprache: Englisch Gewicht in Gramm: 1000.

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Academic Paper from the year 2024 in the subject Computer Sciences - Artificial Intelligence, , language: English, abstract: Our book provides a succinct summary of Artificial Intelligence applications across multiple Very-Large-Scale Integration (VLSI) design flow and testing domains. One technique of fabrication, CMOS technology, is where the evolution of VLSI begins. Complementary Metal Oxide Semiconductor (CMOS) offers numerous advantages but to pack high number of Integrated Circuits (ICs) in compact geometries, VLSI enters into picture. We can design VLSI using Computer Aided Tools like Electronic Design Automation (EDA). VLSI design consists of two primary parts: the front end and the back end. Fabrication procedures such as Architectural Design, Gate Level Design, Simulation, Hardware Descriptive Language (HDL), Circuit Level Design, Verification, and Fabrication are included at the back end. Descriptive languages for hardware are the main emphasis of front end. HDL is essential to system design use because it enables the behavior of the core system to be verified and modelled prior to the design being converted by synthesis tools into physical hardware, such as gates and wires. Different chemical and physical processes are needed for the backend operations. It is possible to create Artificial Intelligence algorithms that aid in raising the yield of physical processes. Artificial Intelligence and Machine Learning (AI-ML) algorithms assist in predicting parametric yield at the device level. Furthermore AI-ML algorithms are implemented at the gate level to analyse the total latency of the gate connection. Also, AI-ML algorithms can be used at the circuit level to maximize the performance of circuits. A combination of AI-ML algorithms in EDA tools allows for the examination of propagation delay, power leakage, etc. During lithography, transfer learning can be used to produce data. Effective testing becomes a crucial task as electronic systems and components becoming more complex, striking a balance between the need for high quality and cost effectiveness. In spite of its labour-intensive nature, testing has become a critical technique for cutting total costs in the production of electronic systems, boards, and VLSI chips. It plays a critical role in ensuring that VLSI design satisfy quality requirement by identifying circuit faults. In order to handle the complexity of contemporary systems, recent developments have incorporated machine learning (ML) and artificial intelligence (AI) into established VLSI testing techniques.…

Zustand: New. In English.

Hardcover. Zustand: Very Good. First Edition. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. In English.

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:0122968603. …

Zustand: New. In English.

Paperback. Zustand: Brand New. revised expanded edition. 281 pages. 9.26x6.10x0.60 inches. In Stock.

Paperback. Zustand: Brand New. 300 pages. 9.25x6.10x0.63 inches. In Stock.

Hardcover. Zustand: Brand New. 2011 edition. 197 pages. 9.25x6.25x0.50 inches. In Stock.

Zustand: Good. 678 pp., Hardcover, ex library, else text and binding clean and tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.…

Paperback. Zustand: Brand New. 362 pages. 9.25x6.10x0.75 inches. In Stock.

Hardcover. Zustand: Brand New. 295 pages. 9.25x6.25x1.00 inches. In Stock.