thermal management electronic systems (20 Ergebnisse)

Softcover. Zustand: Bon. Ancien livre de bibliothèque. Edition 1998. Tome 3. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Good. Former library book. Edition 1998. Volume 3. Ammareal gives back up to 15% of this item's net price to charity organizations.

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Paperback. Zustand: Brand New. 335 pages. 9.45x6.30x0.80 inches. In Stock.

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Taschenbuch. Zustand: Neu. Thermal Management of Electronic Systems II | Proceedings of EUROTHERM Seminar 45, 20-22 September 1995, Leuven, Belgium | E. Beyne (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9789401063180 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Thermal Management of Electronic Systems | Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands | C. J. Hoogendoorn (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9789401044721 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS | PHASE CHANGE MATERIAL BASED HYBRID THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS AND SYSTEMS | Ravi Kandasamy (u. a.) | Taschenbuch | 152 S. | Englisch | 2010 | LAP LAMBERT Academic Publishing | EAN 9783838360874 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the 'lower' end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.

Hardcover. Zustand: Brand New. 1st edition. 348 pages. 10.00x6.75x1.00 inches. In Stock.

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Zustand: New. The volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognised as an important factor in current design methodology. The topics covered include thermal management in general, analytica.

Gebunden. Zustand: New. This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermall.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognised as an important factor in current design methodology. The topics covered include thermal management in general, analytical and computational thermal modelling, thermal characterisation of components, single and multiphase convective cooling, measurement techniques, thermomechanical modelling and thermally induced failure. Audience: Research and development engineers and scientists whose work involves the design and manufacture of electronic systems.

Zustand: Sehr gut. 368 Seiten Dieselbe ISBN, anderes Cover, kleine Lagerspuren am Buch, Inhalt einwandfrei und ungelesen Sprache: Englisch Gewicht in Gramm: 720 24,3 x 16,4 x 2,3 cm, Gebundene Ausgabe.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems.