Thermal management electronic systems (19 Ergebnisse)

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. In English.

Paperback. Zustand: Brand New. 335 pages. 9.45x6.30x0.80 inches. In Stock.

Paperback. Zustand: Brand New. 361 pages. 9.45x6.30x0.85 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the 'lower' end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.…

Taschenbuch. Zustand: Neu. Neuware - The rapid growth of artificial intelligence, high-performance computing, cloud services, and digital infrastructure is pushing conventional data-center cooling systems toward increasingly difficult engineering limits. Modern processors and accelerators generate extraordinary heat densities, while the energy required to reject that heat can represent a significant portion of total facility consumption.For decades, the standard solution has been to place increasingly sophisticated refrigeration, chilled-water, air-handling, and heat-rejection systems around increasingly powerful computing equipment. Yet this approach creates a fundamental engineering question: What if the environment surrounding the data center could become the heat sink Underwater and submerged data centers offer a radically different thermal architecture. Instead of rejecting heat into increasingly warm outdoor air through cooling towers, dry coolers, or mechanical refrigeration systems, submerged infrastructure can potentially transfer heat directly into a large, stable body of water.The concept is deceptively simple. The engineering is not.A submerged electronic system must operate within an environment characterized by hydrostatic pressure, seawater corrosion, biological growth, restricted physical access, demanding reliability requirements, and complex interactions between electronics, coolant, heat exchangers, structural containment, and the surrounding water.At the same time, modern computing loads are becoming more thermally concentrated. AI accelerators and HPC processors can produce enormous heat fluxes within relatively small physical areas. Traditional air cooling becomes progressively more challenging at these densities, increasing interest in direct-to-chip liquid cooling, immersion cooling, and other advanced thermal-management technologies.This book examines these technologies from an engineering perspective.The objective is not simply to demonstrate that seawater can absorb heat. Rather, it is to establish a complete thermal-management framework extending from the semiconductor junction to the final heat sink: Chip ? cold plate or dielectric coolant ? coolant loop ? heat exchanger ? seawater ? surrounding environment.Every link in this chain must be properly designed.The book therefore examines thermodynamics, heat transfer, fluid mechanics, materials compatibility, hydrostatic pressure, pumping energy, heat exchanger performance, biofouling, corrosion, monitoring, controls, reliability, and lifecycle considerations.…

Zustand: New. In English.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Thermal Management of Electronic Systems II | Proceedings of EUROTHERM Seminar 45, 20-22 September 1995, Leuven, Belgium | E. Beyne (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9789401063180 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Zustand: Neu. Thermal Management of Electronic Systems | Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands | C. J. Hoogendoorn (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9789401044721 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Zustand: Neu. THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS | PHASE CHANGE MATERIAL BASED HYBRID THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS AND SYSTEMS | Ravi Kandasamy (u. a.) | Taschenbuch | 152 S. | Englisch | 2010 | LAP LAMBERT Academic Publishing | EAN 9783838360874 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognised as an important factor in current design methodology. The topics covered include thermal management in general, analytical and computational thermal modelling, thermal characterisation of components, single and multiphase convective cooling, measurement techniques, thermomechanical modelling and thermally induced failure. Audience: Research and development engineers and scientists whose work involves the design and manufacture of electronic systems.…

Gebunden. Zustand: New. The volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognised as an important factor in current design methodology. The topics covered include thermal management in general, analytica.

Gebunden. Zustand: New. This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermall.

Hardcover. Zustand: Brand New. 1st edition. 348 pages. 10.00x6.75x1.00 inches. In Stock.

Hardcover. Zustand: Brand New. 361 pages. 10.00x6.75x0.75 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems.…

Zustand: Sehr gut. 368 Seiten Dieselbe ISBN, anderes Cover, kleine Lagerspuren am Buch, Inhalt einwandfrei und ungelesen Sprache: Englisch Gewicht in Gramm: 725 24,3 x 16,4 x 2,3 cm, Gebundene Ausgabe.