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In den WarenkorbZustand: New. pp. 204 Illus.
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Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
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Sprache: Englisch
Verlag: Springer Berlin Heidelberg, Springer Berlin Heidelberg, 2013
ISBN 10: 3642373674 ISBN 13: 9783642373671
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book outlines the most important characteristics of IEEE 802.15.4 and ZigBee and how they can be used to engineer Wireless Sensor Network (WSN) systems and applications, with a particular focus on Quality-of-Service (QoS) aspects. It starts by providing a snapshot of the most relevant features of these two protocols, identifying some gaps in the standard specifications. Then it describes several state-of-the-art open-source implementations, models and tools that have been designed by the authors and have been widely used by the international community. The book also outlines the fundamental performance limits of IEEE 802.15.4/ZigBee networks, based on well-sustained analytical, simulation and experimental models, including how to dimension such networks to optimize delay/energy trade-offs.
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Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. IEEE 802.15.4 and ZigBee as Enabling Technologies for Low-Power Wireless Systems with Quality-of-Service Constraints | Stefano Tennina (u. a.) | Taschenbuch | SpringerBriefs in Electrical and Computer Engineering | x | Englisch | 2013 | Springer | EAN 9783642373671 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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In den WarenkorbZustand: New. pp. 389.
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Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes Königreich
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In den WarenkorbHRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
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In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 389 pages. 9.25x6.14x0.88 inches. In Stock.
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - transconductance e ciency of all critical devices in order to reduce the n- essary bias current. However, reducing the current density also results in a severely decreased device f . An optimization of the current density is re- T quired to provide the correct balance between transconductance e ciency and bandwidth. Plots such as Figure 2. 1 are useful tools for designers when choosing appropriate transistor bias points. Technology scaling allows greatly increased f realization for a given IC. Thus, weak inversion biasing for RF T design will become increasingly useful in future technology nodes. Throughout this work, the IC of critical transistors will be discussed. Most of the RF devices are biased in moderate to weak inversion to achieve enhanced transconductance e ciency and reduced bias current. 2. 2 MEMS Background The relatively new eld of Radio Frequency Microelectro Mechanical Systems (RF MEMS) provides unique opportunities for RF transceiver designers. This section provides background on RF MEMS and provides insight into the - portunities presented by these new technologies. The eld of RF MEMS - cludes the design and utilization of RF lters, resonators, switches, and other passive mechanical structures constructed using bulk processed integrated c- cuit fabrication techniques. To date, these devices have been commercially used as discrete board-mounted components, primarily used to enhance the miniaturization of mobile phones. However, RF MEMS components have the potential to be batch fabricated using existing integrated circuit fabrication techniques.
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Taschenbuch. Zustand: Neu. Ultra-Low Power Wireless Technologies for Sensor Networks | Brian Otis (u. a.) | Taschenbuch | Integrated Circuits and Systems | xv | Englisch | 2011 | Springer | EAN 9781441940469 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - transconductance e ciency of all critical devices in order to reduce the n- essary bias current. However, reducing the current density also results in a severely decreased device f . An optimization of the current density is re- T quired to provide the correct balance between transconductance e ciency and bandwidth. Plots such as Figure 2. 1 are useful tools for designers when choosing appropriate transistor bias points. Technology scaling allows greatly increased f realization for a given IC. Thus, weak inversion biasing for RF T design will become increasingly useful in future technology nodes. Throughout this work, the IC of critical transistors will be discussed. Most of the RF devices are biased in moderate to weak inversion to achieve enhanced transconductance e ciency and reduced bias current. 2. 2 MEMS Background The relatively new eld of Radio Frequency Microelectro Mechanical Systems (RF MEMS) provides unique opportunities for RF transceiver designers. This section provides background on RF MEMS and provides insight into the - portunities presented by these new technologies. The eld of RF MEMS - cludes the design and utilization of RF lters, resonators, switches, and other passive mechanical structures constructed using bulk processed integrated c- cuit fabrication techniques. To date, these devices have been commercially used as discrete board-mounted components, primarily used to enhance the miniaturization of mobile phones. However, RF MEMS components have the potential to be batch fabricated using existing integrated circuit fabrication techniques.
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In den WarenkorbGebunden. Zustand: New. .presents the latest findings from military-sponsored academic research on wireless communications from a hardware design perspective. (SciTech Book News, Vol. 25, No. 4, December 2001)TATSUO ITOH, PhD, is Professor in the Electrical Engineering D.
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In den WarenkorbHardcover. Zustand: Brand New. 1st edition. 468 pages. 9.25x6.25x1.00 inches. In Stock.
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In den WarenkorbZustand: New. The proposed book will contain up to date and recent developments in wireless communications from a hardware design perspective. Thirteen chapters will deal with various fundamental research aspects of low power wireless electronics written by world class experts in each field. Editor(s): Itoh, Tatsuo; Haddad, George M.; Harvey, James. Num Pages: 480 pages, illustrations. BIC Classification: TJKR; UYF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 237 x 164 x 31. Weight in Grams: 866. . 2001. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
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Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
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In den WarenkorbHardcover. Zustand: Brand New. 1st edition. 400 pages. 9.33x6.38x0.98 inches. In Stock.