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In den WarenkorbHRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 152,57
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In den WarenkorbZustand: New. In.
EUR 186,39
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In den WarenkorbZustand: New. pp. 312.
EUR 168,26
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In den WarenkorbGebunden. Zustand: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics.
EUR 218,70
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In den WarenkorbHardcover. Zustand: Brand New. 1st edition. 312 pages. 9.75x6.50x0.75 inches. In Stock.
EUR 240,56
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In den WarenkorbZustand: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Editor(s): Pecht, Michael. Num Pages: 312 pages, Ill. BIC Classification: TGP; TGX; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 242 x 159 x 20. Weight in Grams: 539. . 1993. Hardback. . . . . Books ship from the US and Ireland.
Buch. Zustand: Neu. Neuware - Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.