Optoelectronic packaging (14 Ergebnisse)

Hardback. Zustand: Good. This title presents both the foundational theory of optoelectronic packaging and the many practical applications. Topics covered include component level packaging, guided wave interconnects, free space interconnects, and displays.

Zustand: sehr gut. 313 S., Abb., 21 cm. Sprache: Deutsch.

Hardcover. Zustand: Gut. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. Sprache: Englisch Gewicht in Gramm: 550.

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Hardcover. Zustand: Good. The missing link in a dynamically growing field - a state-of-the-art reference on optoelectronic packaging The rapidly expanding field of packaging for optoelectronic devices challenges electrical engineers with a host of complex and daunting problems. The increasing intricacy of assemblage compounds the thorny interconnection issues associated with electronic packaging-how to assemble an array with many elements efficiently while maintaining thermal tolerance and simultaneously overcoming the ensuing modulation problems that generate electrical noise. Adding to these problems has been the absence, until now, of a single authoritative reference on the subject. Optoelectronic Packaging is the first and only comprehensive sourcebook on optoelectronic assembly techniques. For optoelectronic packaging experts and professionals in adjunct technologies, it provides an overview of today's state-of-the-art technologies, packages now on the drawing board, and the future direction of packaging types.;This incomparable text features contributions from hands-on practitioners and, supplemented with extensive illustrations, it Covers detector, semiconductor laser, and optical amplifier packaging Discusses waveguide technologies, free-space interconnects, and hybrid technologies Examines communication system interconnection structure and fiber-optic networks in telecommunications Explores array device packaging and flip-chip assembly for smart pixel arrays Includes case studies of packaged subassemblies Copyright © Wiley.…

Zustand: Fine. 471 pp., hardcover, THIS IS A BRAND NEW, NEVER-OPENED BOOK!! - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country. Photos available upon request.…

Zustand: New. pp. 280.

paperback. Zustand: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto. …

paperback. Zustand: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-08-01 Pages: 216 Language: Chinese Publisher: Huazhong University of Science and Technology Publishing House LED packaging technology base and job tasks to resolve technical and vocational education . second five curriculum reform planning materials Optoelectronic Technology ( Information ) class contains two parts: the first part introduces the basic concepts of the various aspects of LED industry chain and basic knowledge of the specific content including the LED s.Four Satisfaction guaranteed,or money back.…

Hardcover. Zustand: New. Hardcover Pages Number: 433 Language: Chinese. Semiconductor Science and Technology Series: Optoelectronic devices microwave packaging and testing (2nd Edition) summary of years of work experience and recent research results. the system introduces high-speed optoelectronic devices test a total of 12 chapters. and practical techniques for microwave packaging design. advanced. academic and practical both the book and includes a semiconductor laser light modulation device and a photodetector thr.…

paperback. Zustand: New. Language:Chinese.Paperback. Publisher: Science out.

Zustand: New.

Zustand: New.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.