Sprache: Englisch
Verlag: Warrendale, Pa., Materials Research Society, 1999
ISBN 10: 1558994521 ISBN 13: 9781558994522
Anbieter: Antiquariat Bookfarm, Löbnitz, Deutschland
Hardcover. 246 S. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. 1558994521 Sprache: Englisch Gewicht in Gramm: 550.
Sprache: Englisch
Verlag: Cambridge University Press, 2014
ISBN 10: 1107413214 ISBN 13: 9781107413214
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 39,21
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Sprache: Englisch
Verlag: Cambridge University Press, 2014
ISBN 10: 1107413214 ISBN 13: 9781107413214
Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New.
Sprache: Englisch
Verlag: Cambridge University Press, 2014
ISBN 10: 1107413214 ISBN 13: 9781107413214
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectromechanical systems (MEMS) hold great promise for sensing and actuating on the micron scale. There is a hierarchy of increasing difficulty for placing MEMS devices in the field. Devices that do not allow contact between structural members rely mainly on mechanical properties of freestanding films. High-resolution techniques must be developed within the framework of MEMS to measure properties such as modulus and residual stress. When contact and rubbing contact are allowed, the complexities of adhesion and friction at the microscale must be understood and well controlled. Fluid interactions are similarly important for microfluidic devices. Packaging of MEMS for use in the field also requires special consideration, because it is often application specific. This book investigates various materials, characterization methods and processing techniques. These approaches represent different but useful strategies to solve MEMS challenges, and must be integrated for product realization. Topics include: deposition and characterization of Si; materials and processes for MEMS; tribology; dynamic optical characterization; packaging; LIGA; materials aspects; and characterization of MEMS processing.