Materials advanced packaging (40 Ergebnisse)

Taschenbuch. Zustand: Neu. Neuware - The semiconductor industry forms the technological foundation of modern civilization. From artificial intelligence computing platforms and advanced data centers to automotive electronics, renewable energy systems, communication networks, and intelligent consumer devices, semiconductor technology continues to drive the progress of the digital era. At the center of this transformation is the integrated circuit, where billions of transistors are manufactured with extraordinary precision at the atomic and molecular scale.Although semiconductor devices power nearly every aspect of modern life, the complex manufacturing processes behind them remain largely invisible outside advanced fabrication facilities. Within these highly controlled environments, engineers combine materials science, physics, chemistry, mechanical engineering, and advanced automation systems to transform silicon wafers into sophisticated electronic devices.The Semiconductor Manufacturing Handbook provides a comprehensive exploration of the technologies, manufacturing processes, equipment, materials, and engineering principles behind modern semiconductor fabrication. This book bridges the gap between semiconductor theory and the practical challenges encountered in high-volume industrial chip production.Rather than focusing only on technology marketing terms such as 'nanometer nodes,' this handbook examines the engineering foundations that make advanced semiconductor devices possible, including wafer preparation, lithography, deposition, etching, ion implantation, process integration, defect control, metrology, advanced packaging, and semiconductor testing.Designed for semiconductor engineers, electrical and electronics engineers, researchers, engineering students, and technology professionals, this book provides a structured understanding of how modern integrated circuits are manufactured and how emerging semiconductor technologies are shaping the future of computing, energy, transportation, and electronics.By combining fundamental concepts with industrial manufacturing practices, this handbook serves as a practical reference for understanding the complete semiconductor manufacturing journey-from raw silicon materials and wafer fabrication to advanced chip architectures and next-generation semiconductor technologies.…

Zustand: New.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Gut. 719 S. : Mit Abb., graph. Darst.; Sehr sauber und ohne Lesespuren / Very good condition, maybe unread book. Sprache: Englisch Gewicht in Gramm: 1193 24 cm, roter Org.-Pappb. / red hardcover.

Hardcover. Zustand: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less.

Paperback. Zustand: Brand New. 412 pages. 9.19x6.13x0.93 inches. In Stock.

Zustand: Used.

Taschenbuch. Zustand: Neu. Food Packaging | Advanced Materials, Technologies, and Innovations | Sanjay Mavinkere Rangappa (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2023 | CRC Press | EAN 9780367556006 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu.…

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 316 | Sprache: Englisch | Produktart: Bücher | This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respective research domain, its thirteen chapters discuss in detail fundamental knowledge on bio based materials. It is intended as a reference book for researchers, students, research scholars, academicians and scientists seeking biobased materials for food packaging applications.…

Zustand: Hervorragend. Zustand: Hervorragend | Seiten: 316 | Sprache: Englisch | Produktart: Bücher | This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respective research domain, its thirteen chapters discuss in detail fundamental knowledge on bio based materials. It is intended as a reference book for researchers, students, research scholars, academicians and scientists seeking biobased materials for food packaging applications.…

Zustand: Used.

Zustand: New.

Hardcover. Zustand: Brand New. 247 pages. 11.50x9.00x0.75 inches. In Stock.

Zustand: New. In English.

Zustand: New. In English.

Buch. Zustand: Neu. Neuware - Food packaging is the process that involves enclosing food in such a way that it does not get damaged, contaminated, spoiled, attacked by pests, or tampered during transport, storage and retail sale. The package contains nutritional facts label and other information such as the amount of the contents, ingredients and shelf life. There are various materials used for food packaging such as aseptic packages, plastic trays, bags, bottles, boxes, cartons, pallets, and wrappers. Apart from these, atmosphere packaging, bags-in-boxes, and wine box packaging are three specialized techniques of packaging. Vacuum packaging or inert atmosphere packaging is a common method in which foods are packaged at reduced pressure or by the use of an inert gas such as nitrogen. Bags-in-boxes is another type of packaging technique that is used for packing soft drink syrups, other liquid products, and meat products. To ensure sustainability and avoid the use of plastic, the food packaging industry is shifting its focus to manufacture of antimicrobial active, biodegradable, edible, and biopolymer film packaging. This book discusses the advanced materials, technologies and innovations related to food packaging. It is appropriate for students seeking detailed information in this area as well as for experts.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.…

Taschenbuch. Zustand: Neu. Electronic Materials Innovations and Reliability in Advanced Memory Packaging | Chong Leong Gan (u. a.) | Taschenbuch | Springer Series in Reliability Engineering | xv | Englisch | 2026 | Springer | EAN 9783031947971 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.…

Zustand: New. In English.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respective research domain, its thirteen chapters discuss in detail fundamental knowledge on bio based materials. It is intended as a reference book for researchers, students, research scholars, academicians and scientists seeking biobased materials for food packaging applications.…

Taschenbuch. Zustand: Neu. Advanced Graphic Communications, Packaging Technology and Materials | Yun Ouyang (u. a.) | Taschenbuch | Lecture Notes in Electrical Engineering | xxvi | Englisch | 2019 | Springer | EAN 9789811090783 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Hardcover. Zustand: Brand New. 280 pages. 9.25x6.10x9.32 inches. In Stock.

Taschenbuch. Zustand: Neu. Materials for Advanced Packaging | Daniel Lu (u. a.) | Taschenbuch | xvi | Englisch | 2018 | Springer | EAN 9783319832098 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book includes a selection of reviewed papers presented at the 2015, 4th China Academic Conference on Printing and Packaging, which was held on October 22-24, 2015 in Hangzhou, China. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Hangzhou Dianzi University. With 3 keynote talks and 200 presented papers on graphic communications, packaging technologies and materials, the conference attracted more than 400 scientists. These proceedings cover the recent research outcomes on color science and technology, image-processing technology, digital-media technology, printing-engineering technology, packaging-engineering technology etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, materials science, computer science, digital media and network technology fields.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book includes a selection of reviewed papers presented at the 2015, 4th China Academic Conference on Printing and Packaging, which was held on October 22-24, 2015 in Hangzhou, China. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Hangzhou Dianzi University. With 3 keynote talks and 200 presented papers on graphic communications, packaging technologies and materials, the conference attracted more than 400 scientists. These proceedings cover the recent research outcomes on color science and technology, image-processing technology, digital-media technology, printing-engineering technology, packaging-engineering technology etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, materials science, computer science, digital media and network technology fields.…

Zustand: New. In English.

Hardcover. Zustand: Brand New. 316 pages. 9.25x6.10x0.94 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.…

Zustand: Gut. Zustand: Gut | Seiten: 640 | Sprache: Englisch | Produktart: Bücher | The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry¿s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.…