International conference electronics engineering (146 Ergebnisse)

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Paperback. Zustand: Brand New. 146 pages. 9.00x5.75x0.25 inches. In Stock.

Paperback. Zustand: Brand New. 2010 edition. 112 pages. 9.50x6.25x0.25 inches. In Stock.

Paperback. Zustand: Brand New. 300 pages. 9.25x6.10x0.63 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.…

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

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Gebundene Ausgabe. Zustand: Neu. This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems. Sprache: Englisch Gewicht in Gramm: 565.…

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Zustand: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

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Zustand: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Hardback. Zustand: New.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

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Zustand: New. In English.

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Zustand: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Zustand: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Zustand: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Hardback. Zustand: New.