Search preferences
Direkt zu den wichtigsten Suchergebnissen

Suchfilter

Produktart

  • Alle Product Types 
  • Bücher (13)
  • Magazine & Zeitschriften (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Comics (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Noten (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Kunst, Grafik & Poster (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Fotografien (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Karten (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Manuskripte & Papierantiquitäten (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)

Zustand Mehr dazu

  • Neu (13)
  • Wie Neu, Sehr Gut oder Gut Bis Sehr Gut (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Gut oder Befriedigend (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Ausreichend oder Schlecht (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Wie beschrieben (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)

Weitere Eigenschaften

  • Erstausgabe (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Signiert (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Schutzumschlag (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Angebotsfoto (9)

Sprache (1)

Preis

  • Beliebiger Preis 
  • Weniger als EUR 20 (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • EUR 20 bis EUR 40 (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)
  • Mehr als EUR 40 
Benutzerdefinierte Preisspanne (EUR)

Gratisversand

  • Kostenloser Versand nach USA (Keine weiteren Ergebnisse entsprechen dieser Verfeinerung)

Land des Verkäufers

  • Bild des Verkäufers für Functional Molecular Silicon Compounds II | Low Oxidation States zum Verkauf von preigu

    Buch 24 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer, 2016

    ISBN 10: 331935566X ISBN 13: 9783319355665

    Anbieter: preigu, Osnabrück, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 184,85

    EUR 70,00 Versand
    Versand von Deutschland nach USA

    Anzahl: 5 verfügbar

    In den Warenkorb

    Taschenbuch. Zustand: Neu. Functional Molecular Silicon Compounds II | Low Oxidation States | David Scheschkewitz | Taschenbuch | ix | Englisch | 2016 | Springer | EAN 9783319355665 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

  • Buch 23 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer, 2016

    ISBN 10: 3319346369 ISBN 13: 9783319346366

    Anbieter: preigu, Osnabrück, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 184,85

    EUR 70,00 Versand
    Versand von Deutschland nach USA

    Anzahl: 5 verfügbar

    In den Warenkorb

    Taschenbuch. Zustand: Neu. Functional Molecular Silicon Compounds I | Regular Oxidation States | David Scheschkewitz | Taschenbuch | ix | Englisch | 2016 | Springer | EAN 9783319346366 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

  • Buch 23 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer International Publishing, Springer International Publishing Mär 2014, 2014

    ISBN 10: 331903619X ISBN 13: 9783319036199

    Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 213,99

    EUR 60,00 Versand
    Versand von Deutschland nach USA

    Anzahl: 2 verfügbar

    In den Warenkorb

    Buch. Zustand: Neu. Neuware -The series Structure and Bonding publishes critical reviews on topics of research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant.The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors. Readership: research scientists at universities or in industry, graduate students Special offer For all customers who have a standing order to the print version of Structure and Bonding, we offer free access to the electronic volumes of the Series published in the current year via SpringerLink.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 244 pp. Englisch.

  • Buch 24 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer International Publishing, Springer International Publishing Mär 2014, 2014

    ISBN 10: 3319037331 ISBN 13: 9783319037332

    Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 213,99

    EUR 60,00 Versand
    Versand von Deutschland nach USA

    Anzahl: 2 verfügbar

    In den Warenkorb

    Buch. Zustand: Neu. Neuware -The series Structure and Bonding publishes critical reviews on topics of research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant.The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors. Readership: research scientists at universities or in industry, graduate students Special offer for all customers who have a standing order to the print version of Structure and Bonding, we offer free access to the electronic volumes of the Series published in the current year via SpringerLink.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 244 pp. Englisch.

  • Buch 24 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer International Publishing, Springer International Publishing Aug 2016, 2016

    ISBN 10: 331935566X ISBN 13: 9783319355665

    Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 213,99

    EUR 60,00 Versand
    Versand von Deutschland nach USA

    Anzahl: 2 verfügbar

    In den Warenkorb

    Taschenbuch. Zustand: Neu. Neuware -The series Structure and Bonding publishes critical reviews on topics of research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant.The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors. Readership: research scientists at universities or in industry, graduate students Special offer for all customers who have a standing order to the print version of Structure and Bonding, we offer free access to the electronic volumes of the Series published in the current year via SpringerLink.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 244 pp. Englisch.

  • Buch 23 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer, Palgrave Macmillan, 2014

    ISBN 10: 331903619X ISBN 13: 9783319036199

    Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 213,99

    EUR 62,68 Versand
    Versand von Deutschland nach USA

    Anzahl: 1 verfügbar

    In den Warenkorb

    Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The series Structure and Bonding publishes critical reviews on topics of research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant.The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors.Readership: research scientists at universities or in industry, graduate studentsSpecial offer For all customers who have a standing order to the print version of Structure and Bonding, we offer free access to the electronic volumes of the Series published in the current year via SpringerLink.

  • Buch 24 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer International Publishing, 2016

    ISBN 10: 331935566X ISBN 13: 9783319355665

    Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 213,99

    EUR 61,88 Versand
    Versand von Deutschland nach USA

    Anzahl: 1 verfügbar

    In den Warenkorb

    Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The series Structure and Bonding publishes critical reviews on topics of research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant.The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors. Readership: research scientists at universities or in industry, graduate students Special offer for all customers who have a standing order to the print version of Structure and Bonding, we offer free access to the electronic volumes of the Series published in the current year via SpringerLink.

  • Buch 23 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer International Publishing, 2016

    ISBN 10: 3319346369 ISBN 13: 9783319346366

    Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 213,99

    EUR 61,88 Versand
    Versand von Deutschland nach USA

    Anzahl: 1 verfügbar

    In den Warenkorb

    Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The series Structure and Bonding publishes critical reviews on topics of research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant.The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors.Readership: research scientists at universities or in industry, graduate studentsSpecial offer For all customers who have a standing order to the print version of Structure and Bonding, we offer free access to the electronic volumes of the Series published in the current year via SpringerLink.

  • Buch 24 von 52: Structure and Bonding

    David Scheschkewitz

    Sprache: Englisch

    Verlag: Springer International Publishing, 2014

    ISBN 10: 3319037331 ISBN 13: 9783319037332

    Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 213,99

    EUR 62,68 Versand
    Versand von Deutschland nach USA

    Anzahl: 1 verfügbar

    In den Warenkorb

    Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The series Structure and Bonding publishes critical reviews on topics of research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant.The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors. Readership: research scientists at universities or in industry, graduate students Special offer for all customers who have a standing order to the print version of Structure and Bonding, we offer free access to the electronic volumes of the Series published in the current year via SpringerLink.

  • Buch 24 von 52: Structure and Bonding

    Scheschkewitz, David (Editor)

    Sprache: Englisch

    Verlag: Springer Verlag, 2014

    ISBN 10: 3319037331 ISBN 13: 9783319037332

    Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 297,89

    EUR 11,49 Versand
    Versand von Vereinigtes Königreich nach USA

    Anzahl: 2 verfügbar

    In den Warenkorb

    Hardcover. Zustand: Brand New. 1st edition. 232 pages. 9.25x6.25x0.75 inches. In Stock.

  • Buch 23 von 52: Structure and Bonding

    Scheschkewitz, David (Editor)

    Sprache: Englisch

    Verlag: Springer Verlag, 2014

    ISBN 10: 331903619X ISBN 13: 9783319036199

    Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 297,89

    EUR 11,49 Versand
    Versand von Vereinigtes Königreich nach USA

    Anzahl: 2 verfügbar

    In den Warenkorb

    Hardcover. Zustand: Brand New. 2014 edition. 233 pages. 9.50x6.50x0.75 inches. In Stock.

  • Buch 23 von 52: Structure and Bonding

    Scheschkewitz, David (Editor)

    Sprache: Englisch

    Verlag: Springer Verlag, 2016

    ISBN 10: 3319346369 ISBN 13: 9783319346366

    Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 296,39

    EUR 28,72 Versand
    Versand von Vereinigtes Königreich nach USA

    Anzahl: 2 verfügbar

    In den Warenkorb

    Paperback. Zustand: Brand New. reprint edition. 244 pages. 9.25x6.10x0.55 inches. In Stock.

  • Buch 24 von 52: Structure and Bonding

    Scheschkewitz, David (Editor)

    Sprache: Englisch

    Verlag: Springer Verlag, 2016

    ISBN 10: 331935566X ISBN 13: 9783319355665

    Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich

    Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

    Verkäufer kontaktieren

    EUR 296,39

    EUR 28,72 Versand
    Versand von Vereinigtes Königreich nach USA

    Anzahl: 2 verfügbar

    In den Warenkorb

    Paperback. Zustand: Brand New. reprint edition. 244 pages. 9.25x6.10x0.58 inches. In Stock.