Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
Anbieter: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Deutschland
Verbandsmitglied: GIAQ
Hardcover/Pappeinband. 420 pages. Like new. Shrink wrapped. / Wie neu. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 1050.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 126,28
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In den WarenkorbZustand: New. In.
EUR 192,00
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 1st edition. 420 pages. 9.75x6.75x1.00 inches. In Stock.
EUR 198,60
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Electrostatic Discharge (ESD) within RF devices can result in the malfunctioning of nearby electronic equipment. This volume is designed as the third in a series of three books addressing Electrostatic Discharge (ESD) physics, devices, circuits and design. Num Pages: 420 pages, Illustrations. BIC Classification: TJKR. Category: (P) Professional & Vocational. Dimension: 249 x 173 x 28. Weight in Grams: 934. . 2006. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
Buch. Zustand: Neu. Neuware - With the growth of high-speed telecommunications and wireless technology, it is becoming increasingly important for engineers to understand radio frequency (RF) applications and their sensitivity to electrostatic discharge (ESD) phenomena. This enables the development of ESD design methods for RF technology, leading to increased protection against electrical overstress (EOS) and ESD.ESD: RF Technology and Circuits:\* Presents methods for co-synthesizisng ESD networks for RF applications to achieve improved performance and ESD protection of semiconductor chips;\* discusses RF ESD design methods of capacitance load transformation, matching network co-synthesis, capacitance shunts, inductive shunts, impedance isolation, load cancellation methods, distributed loads, emitter degeneration, buffering and ballasting;\* examines ESD protection and design of active and passive elements in RF complementary metal-oxide-semiconductor (CMOS), RF laterally-diffused metal oxide semiconductor (LDMOS), RF BiCMOS Silicon Germanium (SiGe), RF BiCMOS Silicon Germanium Carbon (SiGeC), and Gallim Arsenide technology;\* gives information on RF ESD testing methodologies, RF degradation effects, and failure mechanisms for devices, circuits and systems;\* highlights RF ESD mixed-signal design integration of digital, analog and RF circuitry;\* sets out examples of RF ESD design computer aided design methodologies;\* covers state-of-the-art RF ESD input circuits, as well as voltage-triggered to RC-triggered ESD power clamps networks in RF technologies, as well as off-chip protection concepts.Following the authors series of books on ESD, this book will be a thorough overview of ESD in RF technology for RF semiconductor chip and ESD engineers. Device and circuit engineers working in the RF domain, and quality, reliability and failure analysis engineers will also find it a valuable reference in the rapidly growing are of RF ESD design. In addition, it will appeal to graduate students in RF microwave technology and RF circuit design.