Verlag: McGraw-Hill Professional Publishing, 1996
ISBN 10: 0070266948 ISBN 13: 9780070266940
Sprache: Englisch
Anbieter: Better World Books Ltd, Dunfermline, Vereinigtes Königreich
EUR 6,36
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. 2nd Edition. Ships from the UK. Used book that is in clean, average condition without any missing pages.
Anbieter: Books From California, Simi Valley, CA, USA
EUR 8,17
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Very Good.
Verlag: McGraw-Hill Professional Publishing, 1996
ISBN 10: 0070266948 ISBN 13: 9780070266940
Sprache: Englisch
Anbieter: Better World Books, Mishawaka, IN, USA
EUR 9,64
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. 2nd Edition. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.
Verlag: McGraw-Hill Professional Publishing, 1996
ISBN 10: 0070266948 ISBN 13: 9780070266940
Sprache: Englisch
Anbieter: Better World Books: West, Reno, NV, USA
EUR 9,64
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. 2nd Edition. Used book that is in clean, average condition without any missing pages.
Verlag: McGraw-Hill Professional Publishing, 1996
ISBN 10: 0070266948 ISBN 13: 9780070266940
Sprache: Englisch
Anbieter: Better World Books, Mishawaka, IN, USA
EUR 9,64
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. 2nd Edition. Used book that is in clean, average condition without any missing pages.
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
EUR 18,70
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780070542990.
EUR 12,13
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.
EUR 13,77
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. Used book that is in clean, average condition without any missing pages.
Anbieter: ThriftBooks-Phoenix, Phoenix, AZ, USA
EUR 9,65
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 3.4.
Anbieter: ThriftBooks-Dallas, Dallas, TX, USA
EUR 9,65
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 3.4.
EUR 13,95
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less 3.25.
EUR 13,95
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.25.
EUR 13,95
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.25.
EUR 12,13
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Good. No Jacket. Former library book; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.6.
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
EUR 71,41
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 87,26
Währung umrechnenAnzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
EUR 229,95
Währung umrechnenAnzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Provides a comprehensive reference in electronic packaging. This title offers a source of key reference data, practical guidance, and circuit and package design basics. It is intended for mechanical and electrical engineers, chemists, physicists, and materi.
EUR 321,82
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbBuch. Zustand: Neu. Neuware - THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING-COMPLETELY UPDATEDFrom new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others.Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal.Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including:MaterialsThermal ManagementShock, Vibration, and Operational Stress ManagementConnector and Interconnection TechnologiesSoldering and Cleaning TechnologiesSingle Chip Packaging and Ball Grid ArraysSurface Mount TechnologyHybrid and Multichip ModulesChip-Scale, Flip-Chip, and Direct-Chip AttachmentRigid and Flexible Printed-Wiring BoardsPackaging High-Speed and Microwave SystemsPackaging High-Voltage SystemsPackaging of MEMs SystemsPackaging of Optoelectronic Systems.