Advanced flip chip packaging (10 Ergebnisse)

Zustand: New.

Taschenbuch. Zustand: Neu. Advanced Flip Chip Packaging | Ho-Ming Tong (u. a.) | Taschenbuch | vii | Englisch | 2016 | Springer | EAN 9781489979339 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.…

Zustand: New. In English.

Hardcover. Zustand: New. Brand new book, sourced directly from publisher. Dispatch time is 24-48 hours from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Zustand: New. Broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. …

Hardcover. Zustand: Brand New. 2013 edition. 567 pages. 9.25x6.50x1.25 inches. In Stock.

Zustand: As New. Unread book in perfect condition.

paperback. Zustand: New. Paperback. Pub Date: 2017-02-01 Pages: 447 Language: Chinese Publisher: chemical industry press The book written by flip chip package technology world-class specialist. and summarized the past more than ten years of flip chip packaging technology development and new achievements. and made a prospect of the future development trend.The content covers the flip chip market and technology.…