Zustand: Muy bueno. : El 'Manual de Diseño e Ingeniería de Empaquetado Electrónico' es una guía completa que abarca todos los aspectos del diseño y la ingeniería de empaquetado electrónico. Este manual, publicado por Springer, ofrece información detallada sobre los materiales, las técnicas de diseño y los procesos de fabricación utilizados en la industria del empaquetado electrónico. Es un recurso valioso tanto para ingenieros experimentados como para aquellos que se inician en este campo. EAN: 9789401170499 Tipo: Libros Categoría: Tecnología Título: Handbook Of Electronics Packaging Design and Engineering Autor: Bernard S. Matisoff Editorial: Springer Páginas: 672 Formato: tapa blanda.
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Taschenbuch. Zustand: Neu. Handbook Of Electronics Packaging Design and Engineering | Bernard S. Matisoff | Taschenbuch | x | Englisch | 2012 | Springer | EAN 9789401170499 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: - Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. - Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. - Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.