9789400730496 - network-on-chip architectures: a holistic design exploration (lecture notes in electrical engineering, band 45) von nicopoulos, chrysostomos; narayanan, vijaykrishnan; das, chita r. (3 Ergebnisse)
Network-on-Chip Architectures: A Holistic Design Exploration (Lecture Notes in Electrical Engineering, 45)
Nicopoulos, Chrysostomos; Narayanan, Vijaykrishnan; Das, Chita R.
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Taschenbuch. Zustand: Neu. Network-on-Chip Architectures | A Holistic Design Exploration | Chrysostomos Nicopoulos (u. a.) | Taschenbuch | Lecture Notes in Electrical Engineering | xxii | Englisch | 2012 | Springer | EAN 9789400730496 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg,… juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - [2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel's very recently announced 80-core TeraFLOP chip [5] exemplifies… the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.
