Isbn: 9789048150854 - electronic packaging for high reliability, low cost electronics (nato science partnership subseries: 3, band 57) (3 Ergebnisse)

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.…

Taschenbuch. Zustand: Neu. Electronic Packaging for High Reliability, Low Cost Electronics | R. R. Tummala (u. a.) | Taschenbuch | NATO Science Partnership Subseries: 3 | x | Englisch | 2010 | Springer Netherlands | EAN 9789048150854 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Paperback. Zustand: Brand New. 296 pages. 9.25x6.10x0.70 inches. In Stock.