ISBN: 9787030522726 - 【按需印刷】-集成电路三维系统集成与封装工艺（中文导读） (1 Ergebnisse)

paperback. Zustand: New. Paperback. Pub Date: 2017-03-01 Pages: $number Language: Chinese Publisher: Science Press. Journal of Information Science and technology: integrated circuit three-dimensional system integration and encapsulation Technology (Chinese Guide) system discussion for electronic. 2 of optoelectronic and MEMS devices. 5D. 3D. and 3D IC integration and packaging technology .…