ISBN: 9783642231193 - vlsi-soc: technologies for systems integration: 17th ifip wg 10.5/ieee international conference on very large scale integration, vlsi-soc 2009, ... and communication technology, 360, band 360) (4 Ergebnisse)

VLSCI-SOC - Technologies for Systems Integration: 17th Ifip Wg 10.5/Ieee International Conference on Very Large Scale Integration, Vlsi-soc 2009, Florianópolis, Brazil, October 12-15, 2009, Revised Se
Becker, Jurgen (Editor)/ De Oliveira Johann, Marcelo (Editor)/ Reis, Ricardo (Editor)
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Hardcover. Zustand: Brand New. 2011 edition. 197 pages. 9.25x6.25x0.50 inches. In Stock.

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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.…

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Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.…