9783319854618 - Testing of Interposer-Based 2.5D Integrated Circuits von Wang, Ran; Chakrabarty, Krishnendu (3 Ergebnisse)

Zustand: New. In.

Taschenbuch. Zustand: Neu. Testing of Interposer-Based 2.5D Integrated Circuits | Ran Wang (u. a.) | Taschenbuch | xiv | Englisch | 2018 | Springer | EAN 9783319854618 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.