EUR 214,64
Währung umrechnenAnzahl: 4 verfügbar
In den WarenkorbZustand: New.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 275,05
Währung umrechnenAnzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Verlag: Springer International Publishing, Springer International Publishing Dez 2016, 2016
ISBN 10: 3319450972 ISBN 13: 9783319450971
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
EUR 320,99
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbBuch. Zustand: Neu. Neuware -This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 988 pp. Englisch.
Verlag: Springer International Publishing, Springer Nature Switzerland, 2016
ISBN 10: 3319450972 ISBN 13: 9783319450971
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 320,99
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbBuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
EUR 462,50
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 2nd edition. 988 pages. 9.25x6.10x2.76 inches. In Stock.