Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 113,93
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Circuit Design on Plastic Foils | Daniele Raiteri (u. a.) | Taschenbuch | Analog Circuits and Signal Processing | x | Englisch | 2016 | Springer | EAN 9783319364599 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 150,69
Anzahl: 2 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 140 pages. 9.25x6.10x0.33 inches. In Stock.
Sprache: Englisch
Verlag: Springer International Publishing, 2016
ISBN 10: 3319364596 ISBN 13: 9783319364599
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book illustrates a variety of circuit designs on plastic foils and provides all the information needed to undertake successful designs in large-area electronics. The authors demonstrate architectural, circuit, layout, and device solutions and explain the reasons and the creative process behind each. Readers will learn how to keep under control large-area technologies and achieve robust, reliable circuit designs that can face the challenges imposed by low-cost low-temperature high-throughput manufacturing.
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book illustrates a variety of circuit designs on plastic foils and provides all the information needed to undertake successful designs in large-area electronics. The authors demonstrate architectural, circuit, layout, and device solutions and explain the reasons and the creative process behind each. Readers will learn how to keep under control large-area technologies and achieve robust, reliable circuit designs that can face the challenges imposed by low-cost low-temperature high-throughput manufacturing.