Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 60,57
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing, 2019
ISBN 10: 3030207382 ISBN 13: 9783030207380
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This Brief deals with heat transfer and friction in plate and fin extended heat transfer enhancement surfaces. It examines Offset-Strip Fin (OSF), Enhancement Principle, Analytically Based Models for j and f vs. Re, Transition from Laminar to Turbulent Region, Correlationsfor jand f vs. Re, Use of OSF with Liquids, Effect of Percent Fin Offset, Effect of Burred Edges, Louver fin, heat transfer and friction correlations, flow structure in the louver fin array, analytical model for heat transfer and friction, convex louver fin, wavy fin, 3D corrugated fin, perforated fin, pin fins and wire mesh, types of vortex generators, metal foam fin, plain fin, packings, numerical simulation of various types of fins.
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Heat Transfer Enhancement in Plate and Fin Extended Surfaces | Sujoy Kumar Saha (u. a.) | Taschenbuch | SpringerBriefs in Applied Sciences and Technology | xi | Englisch | 2019 | Springer | EAN 9783030207380 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.