9783030085612 - advanced packaging and manufacturing technology based on adhesion engineering: wafer-level transfer packaging and fabrication techniques using ... (springer series in advanced manufacturing) von seok, seonho (3 Ergebnisse)
Sprache: Englisch
Verlag: Springer International Publishing, 2019
Serie: Buch 50 von 74 - Springer Series in Advanced Manufacturing
- Softcover
Anbieter: preigu, Osnabrück, Deutschlandpreigu
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EUR 131,10
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Taschenbuch. Zustand: Neu. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method | Seonho Seok | Taschenbuch | viii | Englisch | 2019 | Springer International Publishing | EAN 9783030085612 | Verantwortliche…Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing, 2019
Serie: Buch 50 von 74 - Springer Series in Advanced Manufacturing
- Softcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
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EUR 149,79
EUR 61,01 VersandVersand von Deutschland nach USAAnzahl: 1 verfügbar
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzo…cyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Sprache: Englisch
Verlag: Springer Nature, 2019
Serie: Buch 50 von 74 - Springer Series in Advanced Manufacturing
- Softcover
Anbieter: Revaluation Books, Exeter, Vereinigtes KönigreichRevaluation Books
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EUR 279,54
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Paperback. Zustand: Brand New. reprint edition. 124 pages. 9.25x6.10x0.28 inches. In Stock.
