ISBN: 9781606505120 - a one-semester course in modeling of vsli interconnections (electronic circuits and semiconductor devices collection) (11 Ergebnisse)

Zustand: New.

Zustand: New.

Zustand: New.

Paperback. Zustand: New. Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits.More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed.This book includes an overview of the future interconnection technologies for the nanotechnology circuits.…

Zustand: New. 180.

Zustand: As New. Unread book in perfect condition.

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Paperback. Zustand: Brand New. 340 pages. 9.00x6.00x1.00 inches. In Stock.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. A One-Semester Course in Modeling of VSLI Interconnections | Ashok Goel | Taschenbuch | Englisch | 2014 | Momentum Press | EAN 9781606505120 | Verantwortliche Person für die EU: Mare Nostrum Group B.V., Doelen 72, 4831 GR BREDA, NIEDERLANDE, gpsr[at]mare-nostrum[dot]co[dot]uk | Anbieter: preigu. …

Paperback. Zustand: New. Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits.More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed.This book includes an overview of the future interconnection technologies for the nanotechnology circuits.…