9781558998698 - transistor scaling: methods, materials and modeling (mrs proceedings, band 913) von edited by scott thompson , faran nouri , wen-chin lee , wilman tsai (4 Ergebnisse)

- Hardcover
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes KönigreichRia Christie Collections
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 47,93
EUR 14,10 VersandVersand von Vereinigtes Königreich nach USAAnzahl: Mehr als 20 verfügbar
Zustand: New. In.

Transistor Scaling: Methods, Materials and Modeling
Lee, W. C. (Editor)/ Nouri, F. (Editor)/ Thompson, S. (Editor)/ Tsai, W. (Editor)
- Hardcover
Anbieter: Revaluation Books, Exeter, Vereinigtes KönigreichRevaluation Books
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 61,70
EUR 11,77 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 2 verfügbar
Hardcover. Zustand: Brand New. 205 pages. 9.00x6.00x0.56 inches. In Stock.

Transistor Scaling: Volume 913: Methods, Materials and Modeling (MRS Proceedings)
Edited by Scott Thompson , Faran Nouri , Wen-Chin Lee , Wilman Tsai
- Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USAKennys Bookstore
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 64,70
EUR 9,19 VersandVersand innerhalb von USAAnzahl: Mehr als 20 verfügbar
Zustand: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Thompson, Scott; Nouri, Faran; Lee, Wen-Chin; Tsai, Wilman. Series: MRS Proceedings. Num Pages: 205 pages, Illustrations. BIC Classification: TGM; TJFD3. Category: (U) Tertiary Educa…tion (US: College). Dimension: 228 x 152 x 18. Weight in Grams: 432. . 2006. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.

- Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 58,08
EUR 62,38 VersandVersand von Deutschland nach USAAnzahl: 1 verfügbar
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - For the past four decades, geometric scaling of silicon CMOS transistors has enabled not only an exponential increase in circuit integration density - Moore's Law - but also a corresponding enhancement in the transistor performance. Simple MOSFET geometric…scaling has driven the industry to date. However, as the transistor gate lengths drop below 35nm and the gate oxide thickness is reduced to 1nm, physical limitations such as off-state leakage current and power density make geometric scaling an increasingly challenging task. In order to continue CMOS device scaling, innovations in device structures and materials are required and the industry needs a new scaling vector. Starting at the 90 and 65nm technology generation, strained silicon has emerged as one such innovation. Other device structures such as multigate FETs may be introduced to meet the scaling challenge. This book shares results and physical models related to MOSFETs and to discuss innovative approaches necessary to continue the transistor scaling. Expanded versions of presentations in the areas of technology development are featured.